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| Directed Nanoscale Self-Assembly of Natural Photosystems on Nitrogen-Doped Carbon Nanotubes for Solar-Energy Harvesting Kim, Insu; Jo, Nyeongbeen; Yang, Moon Young; Kim, Jeonga; Jin, Hwiseok; Lee, Gil Yong; Shin, Taeho; et al, ACS Applied Bio Materials, v.2, no.5, pp.2109 - 2115, 2019-05 |
| Slicing Executable System-of-Systems Models for Efficient Statistical Verification Song, Jiyoung; Torring, Jacob O.; Hyun, Sangwon; Jee, Eunkyoung; Bae, Doo-Hwan, ICSE Joint Conference on IEEE/ACM 7th International Workshop on Software Engineering for Systems-of-Systems / 13th Workshop on Distributed Software Development, Software Ecosystems and Systems-of-Systems (SESoS-WDES), pp.18 - 25, ASSOC COMPUTING MACHINERY, 2019-05 |
| A Simulation-based Behavior Analysis for MCI Response System of Systems Park, Sumin; Mihret, B. Zelalem; Bae, Doo-Hwan, ICSE Joint Conference on IEEE/ACM 7th International Workshop on Software Engineering for Systems-of-Systems / 13th Workshop on Distributed Software Development, Software Ecosystems and Systems-of-Systems (SESoS-WDES), pp.2 - 9, ASSOC COMPUTING MACHINERY, 2019-05 |
| Wake-Up Task: Understanding Users in Task-based Mobile Alarm App Oh, Kyue Taek; Shin, Jaemyung; Kim, Jaejeung; Song, In Suk; Lee, Uichin; Park, Eunil; Han, Jinyoung; et al, CHI Conference on Human Factors in Computing Systems (CHI), ASSOC COMPUTING MACHINERY, 2019-05 |
| Spectrum-Based Fault Localization on a Collaboration Graph of a System-of-Systems Shin, Yong-Jun; Hyun, Sangwon; Baek, Young-Min; Bae, Doo-Hwan, 14th Annual Conference System of Systems Engineering (SoSE), pp.358 - 363, IEEE, 2019-05 |
| A Study on the Flexible Chip-on-Fabric (COF) Assembly using Anisotropic Conductive Films (ACFs) Materials Jung, Seung-Yoon; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.283 - 288, IEEE, 2019-05 |
| Evaluating the Combination of Visual Communication Cues for HMD-based Mixed Reality Remote Collaboration Kim, Seungwon; Lee, Gun; Huang, Weidong; Kim, Hayun; Woo, Woontack; Billinghurst, Mark, CHI Conference on Human Factors in Computing Systems (CHI), ASSOC COMPUTING MACHINERY, 2019-05 |
| Effects of Moderation and Opinion Heterogeneity on Attitude towards the Online Deliberation Experience Perrault, Simon T.; Zhang, Weiyu, CHI Conference on Human Factors in Computing Systems (CHI), ASSOC COMPUTING MACHINERY, 2019-05 |
| Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics Shin, Sangmyung; Lee, Hanmin; Kim, JunMo; Lee, Tae-Ik; Kim, Taek-Soo; Kyung, Youjin; Jeong, Minsu; et al, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.1146 - 1151, IEEE, 2019-05 |
| Asian CHI Symposium: Emerging HCI Research Collection Fujita, Kazuyuki; Sari, Eunice; Kim, Juho; Tedjasaputra, Adi; Do, Ellen Yi-Luen; Liu, Zhengjie; Lee, Uichin; et al, CHI Conference on Human Factors in Computing Systems (CHI), ASSOC COMPUTING MACHINERY, 2019-05 |
| Low Temperature Transient Liquid Phase (TLP) bonding using eutectic Sn-In Solder Anisotropic Condctive Films (ACFs) for Flexible Ultrasound Transducer Park, Jae-Hyeong; Park, Jongcheol; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2213 - 2218, IEEE, 2019-05 |
| Bending Properties of Fine Pitch Flexible CIF (Chip-in-Flex) Packages using APL (Anchoring Polymer Later) ACFs (Anisotropic Conductive Films) Kim, Ji-Hye; Yoon, Dal-Jin; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2272 - 2277, IEEE, 2019-05 |
| A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnBi58 based Anisotropic Conductive Films Zhang, Shuye; Huang, Mingliang; Wu, Yang; Yang, Ming; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2022 - 2028, IEEE, 2019-05 |
| A study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with self-exposed conductive particles surface for ultra-fine pitch Chip-on-Glass (COG) applications Yoon, Dal-Jin; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2266 - 2271, IEEE, 2019-05 |
| Effects of the Curing properties and Viscosities of Non-Conductive Films (NCFs) on the Sn-Ag Solder Bump Joint Morphology and Reliability Lee, HanMin; Lee, Se Yong; Shin, SangMyung; Choi, TaeJin; Park, SooIn; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2278 - 2283, IEEE, 2019-05 |
| Razzer: Finding Kernel Race Bugs through Fuzzing Jeong, Dae R.; Kim, Kyungtae; Shivakumar, Basavesh; Lee, Byoungyoung; Shin, Insik, 40th IEEE Symposium on Security and Privacy (SP), pp.754 - 768, IEEE COMPUTER SOC, 2019-05 |
| Modeling Error Rates in Spatiotemporal Moving Target Selection Huang, Jin; Lee, Byungjoo, CHI Conference on Human Factors in Computing Systems (CHI), ASSOC COMPUTING MACHINERY, 2019-05 |
| Effect of zinc on the environmentally-assisted fatigue behavior of 316 stainless steels in simulated PWR primary environment Kim, Ho-Sub; Lee, Hyeon Bae; Chen, Junjie; Jang, Changheui; Kim, Tae Soon; Stevens, Gary L.; Ahluwalia, Kawaljit, CORROSION SCIENCE, v.151, pp.97 - 107, 2019-05 |
| Development of ROS-based Mobile Robot System and Experiments on Indoor Autonomous Driving Jung, Chanyoung; Kim, Taeyeon; Shim, David Hyunchul, Journal of Institute of Control, Robotics and Systems, v.25, no.5, pp.438 - 444, 2019-05 |
| A Compact Circular Polarization Antenna Using Folded Ground Elements Kim, Kwang-Seok; Kim, Ghoo; Chae, Soo-Chang; Jo, Hye-Won; Yu, Jong-Won; Lee, Han Lim, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.67, no.5, pp.3472 - 3477, 2019-05 |
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