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Showing results 212381 to 212400 of 276390
| Wapee: A fault-tolerant semantic middleware in ubiquitous computing environments Kim, Yoon-Hee; Kim, Eun-Kyung; Jeon, Beom-Jun; Ko, In-Young; Park, Sung-Yong, EMERGING DIRECTIONS IN EMBEDDED AND UBIQUITOUS COMPUTING BOOK SERIES: LECTURE NOTES IN COMPUTER SCIENCE, v.4097, pp.173 - 182, 2006 |
| WAPK, a Ser/Thr protein kinase gene of Nicotiana tabacum, is uniquely regulated by wounding, abscisic acid and methyl jasmonate Chung, Won Il, MOLECULAR AND GENERAL GENETICS, v.259, no.5, pp.516 - 522, 1998 |
| War on Intellectual Property between US and China: Law and Development Perspectives Park, Tae Jung, MANCHESTER JOURNAL OF INTERNATIONAL ECONOMIC LAW, v.19, no.2, pp.197 - 210, 2022-09 |
| War Room Approach Based on Analysis of VOC Park, Sang Chan, 2nd Bilateral Korea-China Quality Management Symposium, pp.301 - 319, 2002 |
| Waring's problem for rational functions Im, Bo-Hae, KMS-DMV Joint Conference, Korean Mathematical Society, 2018-10-04 |
| Waring's problem for rational functions in one variable Im, Bo-Hae, Fudan-KAIST Joint Workshop on Algebra and Geometry, KAIST, 2019-10-11 |
| WARING'S PROBLEM FOR RATIONAL FUNCTIONS IN ONE VARIABLE Im, Bo-Hae; Larsen, Michael, QUARTERLY JOURNAL OF MATHEMATICS, v.71, no.2, pp.439 - 449, 2020-06 |
| Waring's problem of rational functions in one variable Im, Bo-Hae, Number Theory online Conference 2020, CARMA and AMSI, University of Newcastle, 2020-06-03 |
| Warm Season Satellite Precipitation Biases for Different Cloud Types Over Western North Pacific Utsumi, Nobuyuki; Kim, Hyungjun, IEEE GEOSCIENCE AND REMOTE SENSING LETTERS, v.15, no.6, pp.808 - 812, 2018-06 |
| Warm white LEDs에 적용을 위한 3색 발광 $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ 형광체의 합성 및 발광 특성 연구 = Synthesis of tunable full color emitting $La_{0.827}Al_{11.9}O_{19.09}:Eu^{2+}, Mn^{2+}$ phosphor for the application to warm white LEDs and its characterizationlink 원유호; Won, Yu-Ho; et al, 한국과학기술원, 2006 |
| Warming Up Your Tick-Tock: Temperature-Dependent Regulation of Circadian Clocks Ki, Yoonhee; Ri, Hwajung; Lee, Hoyeon; Yoo, Eunseok; Choe, Joonho; Lim, Chunghun, NEUROSCIENTIST, v.21, no.5, pp.503 - 518, 2015-10 |
| Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers 김준모; 이태익; 조우성; 조민수; 김택수, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24 |
| Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |
| Warpage analysis of electroplated Cu films on polymer based packaging core substrate 김철규; 이태익; 김민성; 김택수, MPC2014 Autumn Symposium, MPC, 2014-10-14 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
| Warpage prediction of chip package using simplified model of PCB substrate = PCB 기판의 단순화 모델을 통한 칩 패키지의 휨 예측link Kim, Junmo; Kim, Taek-Soo; et al, 한국과학기술원, 2019 |
| Warped dipole completed, with a tower of Higgs bosons Agashe, Kaustubh; Azatov, Aleksandr; Cui, Yanou; Randall, Lisa; Son, Minho, JOURNAL OF HIGH ENERGY PHYSICS, v.06, no.6, pp.196, 2015-06 |
| Warped Extra Dimensional Benchmarks for Snowmass 2013 Lee, SeungJoon, Snowmass Energy Frontier Workshop, University of Washington, Seattle, USA, 2013-07-02 |
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