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Showing results 204501 to 204520 of 279087
| Threshold-type call control under the outage restriction in a CDMA cellular system Tcha, Dong Wan; Lee, SH; Jin, GW, IEICE TRANSACTIONS ON COMMUNICATIONS, v.E88B, no.9, pp.3701 - 3708, 2005-09 |
| Thrombin induces expression of cytokine-induced SH2 protein (CIS) in rat brain astrocytes: Involvement of phospholipase A(2), cyclooxygenase, and lipoxygenase Ji, Kyung Ae; Yang, Myung Soon; Jou, Ilo; Shong, Minho; Joe, Eun Hye, GLIA, v.48, no.2, pp.102 - 111, 2004-11 |
| Thromboresistant and endothelialization effects of dopamine-mediated heparin coating on a stent material surface Bae, In-Ho; Park, In-Kyu; Park, Dae Sung; Lee, Haeshin; Jeong, Myung Ho, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN MEDICINE, v.23, no.5, pp.1259 - 1269, 2012-05 |
| Throttle and Brake Combined Control for Intelligent Vehicle Highway Systems Choi, Seibum B; Devlin, Peter, 1995 SAE Future Transportation Technology Conference & Exposition, Society of Automotive Engineers, 1995-08-07 |
| Throttle and preempt: A flow control policy for real-time traffic in wormhole networks Song, H; Kwon, B; Yoon, Hyunsoo, JOURNAL OF SYSTEMS ARCHITECTURE, v.45, no.8, pp.633 - 649, 1999-02 |
| Throttle and preempt: A new flow control for real-time communications in wormhole networks Song, H; Kwon, B; Yoon, Hyunsoo, Proceedings of the 1997 International Conference on Parallel Processing, pp.198 - 202, IEEE, 1997-09-11 |
| Throttling effects on dual-fuel premixed charge compression ignition under low load condition in a heavy duty diesel engine Shim, Euijoon; Park, Hyunwook; Bae, Choongsik, 11th Asia-Pacific Conference on Combustion, ASPACC 2017, Combustion Institute, 2017-12 |
| Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01 |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |
| Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
| Through the Eyes of the User: Evaluating Neonatal Intensive Care Unit Design Denham, Megan E.; Bushehri, Yousef; Lim, Lisa, HERD-HEALTH ENVIRONMENTS RESEARCH & DESIGN JOURNAL, v.11, no.3, pp.49 - 65, 2018-07 |
| Through the time tunnel Lee, Miseong; Nam, Tek-Jin, ACM SIGGRAPH 2008, 2008 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Through-space charge transfer and emission color tuning of di-o-carborane substituted benzene Bae, Hye Jin; Kim, Hyungjun; Lee, Kang Mun; Kim, Taewon; Lee, Yoon Sup; Do, Youngkyu; Lee, Min Hyung, DALTON TRANSACTIONS, v.43, no.13, pp.4978 - 4985, 2014-04 |
| Through-thickness compressive strength of a carbon/epoxy composite laminate Kim, Byung Chul; Park, Dong Chang; Kim, Byoung Jung; Lee, Dai Gil, COMPOSITE STRUCTURES, v.92, no.2, pp.480 - 487, 2010-01 |
| Through-thickness compressive strength of carbon-phenolic woven composites Park, DC; Lee, Dai Gil, COMPOSITE STRUCTURES, v.70, no.4, pp.403 - 412, 2005-10 |
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