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| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
| Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
| Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal characteristics of optical gain for GaInNAs quantum wells at 1.3 mu m Kim, CK; Lee, Yong-Hee, APPLIED PHYSICS LETTERS, v.79, no.19, pp.3038 - 3040, 2001-11 |
| Thermal characteristics of organoclay and their effects upon the formation of polypropylene/organoclay nanocomposites Lee, JW; Lim, YT; Park, OOk, POLYMER BULLETIN, v.45, no.2, pp.191 - 198, 2000-09 |
| Thermal characteristics of perforated self-rotating twisted tapes in a double-pipe heat exchanger Zhang, Shaojie; Lu, Lin; Dong, Chuanshuai; Cha, Seung Hyun, APPLIED THERMAL ENGINEERING, v.162, 2019-11 |
| Thermal characteristics of pulsating heat pipes operating in a circulation mode Noh, Hyung Yoon; Kim, Sung-Jin, International Mechanical Engineering Congress & Exposition, ASME, 2016-11-13 |
| Thermal characteristics of samarium-based composite cathode(Sm0.5Sr0.5CoO3/Sm0.2Ce0.8O1.9) for intermediate temperature-operating solid oxide fuel cell 백승욱; 배중면, KSME 2007 Annual Spring Conference, KSME, 2007-05-30 |
| Thermal characteristics of the spindle bearing system with a gear located on the bearing span Choi, JK; Lee, Dai Gil, INTERNATIONAL JOURNAL OF MACHINE TOOLS MANUFACTURE, v.38, no.9, pp.1017 - 1030, 1998-09 |
| Thermal characteristics of tubular single lap adhesive joints under axial loads Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.15, no.12, pp.1511 - 1528, 2001 |
| Thermal characterization and optimization of pulsating heat pipes operating in a circulation mode Noh, Hyung Yun; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.115, pp.1234 - 1246, 2017-12 |
| Thermal characterization of a BGA NVMe solid state drive in Mini-ITX system Lee, Eungchang; Kang, H; Lee, Jungchul; Lee, Bong Jae, The 2nd Pacific Rim Thermal Engineering Conference, JSME, KSME, ASTFE, 2019-12-17 |
| Thermal characterization of liquid analytes via photothermal modulation of microfluidic resonators Yoon, Yeowon; Khan, Faheem; Thundat, Thomas; Lee, Jungchul, The 32nd International Conference on Micro Electro Mechanical Systems, pp.712 - 715, The Society of Micro and Nano Systems, 2019-01-28 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee, WS; Han, Y; Yu, Jin; Kim, SJ; Lee, TY, 6th Electronics Packaging Technology Conference, EPTC 2004, pp.47 - 52, 2005-12-08 |
| Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique Lee W.S.; Byun K.Y.; Han I.Y.; Kim, SungJin; Yu J., THERMOCHIMICA ACTA, v.455, no.1-2, pp.148 - 155, 2007-04 |
| Thermal cis-trans isomerization reaction of cis-1-bromopropene = 시스-1-브로모프로펜의 시스-트란스 열 이성화 반응에 관한 연구link Um, Jae-Young; 엄재영; Jung, Kyung-Hoon; Lee, Yoon-Sup; et al, 한국과학기술원, 1988 |
| Thermal Compatibility of Centrifugally Atomized U-Mo Powders with Al in a Dispersion Fuel Paik, Kyung-Wook; Kim, Ki-Hwan; Lee, Don Bae; Kim, Chang Kyu; Hofman, GL, NUCLEAR ENGINEERING AND DESIGN, v.178, no.1, pp.111 - 117, 1997-12 |
| Thermal compatibility studies of U3Si2 dispersion fuels prepared with centrifugally atomized powder Kim, KH; Park, JM; Kim, CK; Hofman, GL; Paik, Kyung-Wook, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.315 - 321, 1999-04 |
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