Browse by Title
Showing results 200681 to 200700 of 276390
| Thermal Behavior of Boronsilicate Molecular Sieve Woo, Seong-Ihl; Hong, SB; Lee, JK; Uh, YS, Korea Chemical Society Fall Symposium, Korea Chemical Society, 1987 |
| Thermal behavior of crosslinked gelatin with poly(N-isopropylacrylamide) grafts Kang, HS; Kim, BY; Kim, Jong-Duk, The 10th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.0 - 0, 1997-11-01 |
| Thermal behavior of semifluoronated smectic liquid crystals 윤동기; 김대석; 오성대; 김윤호, 2013 춘계학술대회 한국고분자학회, 한국고분자학회, 2013-04-12 |
| Thermal behavior of Sn nanowires for nano-interconnection Shin, H; Song, J; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal buckling analysis of composite cylindrical panels with embedded SMA wires Lee, H.J.; Lee, Jungju, KSCM Annual Autumn Conference, pp.169 - 173, 1997-11 |
| Thermal buckling and acoustic vibration characteristics of the shape memory alloy hybrid composite plate Lee, In; Kim, Eun-Ho; Rim, Mi-Sun, 18th International Congress on Sound and Vibration, International Congress on Sound and Vibration, 2011-07-11 |
| Thermal buckling and deformation of aerospace structures and their improvement with shape memory alloys Lee, In; Kim, E.-H; Roh, J.-H, 8th International Congress on Thermal Stresses, pp.65 - 65, 2009-06-02 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi S., 10th International Conference on Composite Structures, v.47, no.40547, pp.695 - 703, 1999-11-15 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi, S, COMPOSITE STRUCTURES, v.47, no.1-4, pp.695 - 703, 1999-12 |
| Thermal Buckling Characteristics of Composite Conical Shell Structures Woo, Ji-Hye; Rho, Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.8, no.2, pp.82 - 88, 2007-11 |
| Thermal buckling of composite beam with embedded shape memory alloy actuators Lee, Jungju, Proceeding of ICCM, pp.0 - 0, ICCM, 1999-07-05 |
| Thermal buckling of laminated composite beams with embedded shape memory alloy actuators Choi, S; Lee, Jungju; Lee, DC, JOURNAL OF COMPOSITE MATERIALS, v.34, no.18, pp.1529 - 1547, 2000 |
| THERMAL C-O BOND SCISSION IN A MU-3-ETA-2-COORDINATED ACYL - STRUCTURAL CHARACTERIZATION OF A DOUBLY BRIDGING 4-ELECTRON OXO LIGAND SHAPLEY, JR; Park, Joon Taik; CHURCHILL, MR; ZILLER, JW; BEANAN, LR, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.106, no.4, pp.1144 - 1145, 1984 |
| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of composite sandwich structures for machine tool moving body applications Do Suh, J; Lee, Dai Gil, COMPOSITE STRUCTURES, v.66, no.1-4, pp.429 - 438, 2004-10 |
| Thermal characteristics of conduction cooled 600 kJ HTS SMES system Kim, S; Sim, K; Kim, HJ; Bae, JH; Lee, EY; Seong, KC; Jeong, Sangkwon, CRYOGENICS, v.49, pp.294 - 298, 2009-06 |
| Thermal characteristics of InGaP/GaAs HBT ballasted with extended ledge Jeon, S; Park, HM; Hong, Songcheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.48, no.10, pp.2442 - 2445, 2001-10 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal characteristics of optical gain for GaInNAs quantum wells at 1.3 mu m Kim, CK; Lee, Yong-Hee, APPLIED PHYSICS LETTERS, v.79, no.19, pp.3038 - 3040, 2001-11 |
| Thermal characteristics of organoclay and their effects upon the formation of polypropylene/organoclay nanocomposites Lee, JW; Lim, YT; Park, OOk, POLYMER BULLETIN, v.45, no.2, pp.191 - 198, 2000-09 |
Discover
Type
Open Access
Date issued
- 31,394 2020 - 2024
- 99,975 2010 - 2019
- 75,670 2000 - 2009
- 44,727 1990 - 1999
- 14,360 1980 - 1989
- 62 1964 - 1969