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Showing results 200601 to 200620 of 276088
| Thermal instability of effective work function in metal/high-kappa stack and its material dependence Joo, MS; Cho, Byung Jin; Balasubramanian, N; Kwong, DL, IEEE ELECTRON DEVICE LETTERS, v.25, no.11, pp.716 - 718, 2004-11 |
| Thermal insulation performance in 4 K to 2 K JT refrigeration system 김경중; 배준혁; 박세현; Lingxue, Jin; 정상권, 2018 한국초전도저온공학회 동계학술대회, 한국초전도저온공학회, 2018-01-16 |
| Thermal interaction at the interface between a porous medium and an impermeable wall Kim, SungJin; Kim, D, JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, v.123, no.3, pp.527 - 533, 2001-06 |
| Thermal Interaction with a Voice-based Intelligent Agent Kim, Seyeong; Row, Yea-kyung; Nam, Tek-Jin, 2018 CHI Conference on Human Factors in Computing Systems, CHI 2018, ACM Special Interest Group on Computer-Human Interaction (SIGCHI), 2018-04-21 |
| Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 전자공학회지, v.36, no.9, pp.980 - 990, 2009-09 |
| Thermal issues in 3D IC 신인섭; 김상민; 백승훈; 서문준; 유리은; 신영수, 3차원반도체집적기술 특집, 전자공학회지, 2009-09 |
| Thermal Lab-on-a-chip with a PVC-gel Heater Kim, MinKi; ko, eunmin; Kim, Seung Seop; Shin, Jennifer Hyunjong; Kyung, Ki-Uk, The 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2023, Institute of Electrical and Electronics Engineers (IEEE), 2023-05-15 |
| Thermal loading measurement and thermal fatigue test for solder bumps in electronncs packaging Park, TS; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99MF27, pp.55 - 60, 1999 |
| Thermal loading perspective on U.S. nuclear waste repository needs Stahala, Mike P.; Yim Man-Sung; McNelis, David N., 2006 Annual Meeting - American Nuclear Society, v.94, no.2006, pp.329 - 330, Transactions of the American Nuclear Society, 2006-06 |
| Thermal Loading Perspective on U.S. Nuclear Waste Repository Needs Mike Stahala; Yim Man-Sung; David McNelis, Transactions of the American Nuclear Society, v.94, no.2006, pp.329 - 330, American Nuclear Society, 2006-06 |
| Thermal Management in EV Inverters: Optimizing Jet Impingement Cooling with Micropost Integration Kim, Seungwoo; Ki, Seokgan; Bang, Soosik; Han, Sanghyung; Seo, Junyong; Ahn, Chulmin; Maeng, Suhyeon; et al, The 21st International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermal Management of Gallium-based Transformative Electronics through Integration of a Stretchable Radiative Cooler for Reliable Stiffness Tuning in Hot Outdoors Byun, Sanghyuk; Yun, Joo Ho; Heo, Se-Yeon; Shi, Chuanqian; Lee, Gil Ju; Agno, Karen-Christian; Jang, Kyung-In; et al, 2022 MRS Fall Meeting, Materials Research Society, 2022-11-28 |
| Thermal Management Utilizing Ga-based Liquid Metals Nam, Youngsuk, ISHMT Golden Jubilee Lecture series, Indian Society for Heat and Mass Transfer (ISHMT), 2023-04-27 |
| Thermal Management Utilizing Gallium-Based Liquid Metals 남영석, 2023 대한기계학회 열공학부문 춘계학술대회, 사단법인 대한기계학회, 2023-04-20 |
| Thermal maps of gases in heterogeneous reactions Jarenwattananon, Nanette N.; Gloeggler, Stefan; Otto, Trenton; Melkonian, Arek; Morris, William; Burt, Scott R.; Yaghi, Omar M.; et al, NATURE, v.502, no.7472, pp.537 - 537, 2013-10 |
| Thermal metallurgical analysis of GMA welded AH36 steel using CFD-FEM framework Cheon, Jason; Kiran, Degala Venkata; Na, Suck-Joo, Materials and Design, v.91, pp.230 - 241, 2016-02 |
| Thermal modeling of heterojunction bipolar transistors with pulsed I-V measurements Park, Hyun-Min; Jeon, Kye-Ik; Hong, Songcheol, MICROWAVE JOURNAL, v.44, no.3, pp.128 - 128, 2001-03 |
| Thermal Nitriding Behaviour of Fe-V alloy as Metallic Separator for PEMFC Wee, Dang-Moon; Lee, SH; Kim, JH; Kim, MC, 2007 Grove Fuel Cell Symposium, 2007 |
| Thermal Noise Model for Short-Channel MOSFETs Han, Kwangseok; Shin, Hyungcheol; Lee, Kwyro, The 10th Korean Conference on Semiconductors, The 10th Korean Conference on Semiconductors, 2003-02 |
| Thermal Noise Modeling for Short - Channel MOSFET's Lee, Kwyro; Shin, Hyung-Cheol; Han, Kwangseok, International Conference on Simulation of Semiconductor Processes and Devices(SISPAD), pp.79 - 82, 2003 |
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