Showing results 1 to 1 of 1
To cut or Not to cut: A Thermomechanical Stresss Analysis of Polyimide Thin Film on Ceramic Structures Paik, Kyung-Wook; Pecht, Michael; Bhandarkar, S. Navin; Wu, Xin, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.18, no.1, pp.150 - 153, 1995-01 |
Discover