Showing results 53261 to 53280 of 101364
Micromagnetic Modeling of Spin-valve MR Head with Synthetic Antiferromagnet Tahk, Young Wook; Lee, Kyung-Jin; Lee, Taek Dong, JOURNAL OF MAGNETICS, v.7, no.2, pp.55 - 58, 2002-06 |
Micromagnetic modelling on magnetization dynamics in nanopillars driven by spin-transfer torque Kim, Woojin; Lee, Seo-Won; Lee, Kyung-Jin, JOURNAL OF PHYSICS D-APPLIED PHYSICS, v.44, no.38, 2011-09 |
MICROMAGNETIC NONDESTRUCTIVE EVALUATION OF ISOCHRONALLY TEMPERED 12-PERCENT CRMOV STEEL Kim, Ho Chul, SCRIPTA METALLURGICA ET MATERIALIA, v.30, no.3, pp.313 - 318, 1994 |
Micromagnetic simulation of magnetization reversal behavior of Co/Pt multilayer nanodot array prepared by colloidal lithograpy Kim, DH; Jeong, JR; Cho, YC; Shin, Sung-Chul, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.286, pp.23 - 26, 2005-02 |
Micromagnetic simulation study on exchange-coupled composite media Lee, SC; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.99, no.8, 2006-04 |
Micromagnetic studies on exchange-coupled composite media Lee, Taek Dong; Lee, S. C.; Tahk, Y. W., JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.303, no.2, pp.276 - 281, 2006-08 |
Micromagnetic study of single-domain FePt nanocrystals overcoated with silica Hyun, C; Lee, DohChang; Korgel, BA; de Lozanne, A, NANOTECHNOLOGY, v.18, no.5, pp.1 - 7, 2007-02 |
Micromagnetics modeling of single pole head for doublelayered perpendicular media Tahk, YW; Kim, KC; Suh, JD; Lee, Taek Dong, PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, v.201, no.8, pp.1767 - 1770, 2004-06 |
Micromechanical analysis of aligned and randomly oriented whisker-/short fiber-reinforced composites Pyo, SH; Lee, Haeng-Ki, CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, v.40, no.3, pp.271 - 305, 2009-02 |
Micromechanics-based constitutive modeling for unidirectional laminated composites Liang, Z; Lee, Haeng-Ki; Suaris, W, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.43, no.18-19, pp.5674 - 5689, 2006-09 |
Micromechanics-based elastic damage modeling of particulate composites with weakened interfaces Lee, Haeng-Ki; Pyo, S. H., INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.44, no.25-26, pp.8390 - 8406, 2007-12 |
Micromechanics-based elastic-damage analysis of laminated composite structures Pyo, S. H.; Lee, Haeng-Ki, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.46, no.17, pp.3138 - 3149, 2009-08 |
Micromechanics-Based Fiber-Bridging Analysis of Strain-Hardening Cementitious Composite Accounting for Fiber Distribution Lee, BY (Lee, B. Y.); Lee, Y (Lee, Y.); Kim, Jin-Keun; Kim, YY (Kim, Y. Y.), CMES-COMPUTER MODELING IN ENGINEERING SCIENCES, v.61, no.2, pp.111 - 132, 2010-05 |
Micromechanics-Based Homogenization of the Effective Physical Properties of Composites With an Anisotropic Matrix and Interfacial Imperfections Ryu, Seunghwa; Lee, Sangryun; Jung, Jiyoung; Lee, Jinyeop; Kim, Youngsoo, FRONTIERS IN MATERIALS, v.6, 2019-03 |
Micromechanics-based prediction of the effective properties of piezoelectric composite having interfacial imperfections Lee, Sangryun; Jung, Jiyoung; Ryu, Seunghwa, COMPOSITE STRUCTURES, v.240, 2020-05 |
Micromechanics-based viscoelastic damage model for particle-reinforced polymeric composites Yang, B. J.; Kim, B. R.; Lee, Haeng-Ki, ACTA MECHANICA, v.223, no.6, pp.1307 - 1321, 2012-06 |
MICROMECHANISMS OF CREEP CRACK-GROWTH Yu, Jin; HONG, SH, SCRIPTA METALLURGICA, v.23, no.6, pp.957 - 962, 1989-06 |
Micrometer-thick and porous nanocomposite coating for electrochemical sensors with exceptional antifouling and electroconducting properties Lee, Jeong-Chan; Kim, Su Yeong; Song, Jayeon; Jang, Hyowon; Kim, Min; KIM, HANUL; Choi, Siyoung Q.; et al, NATURE COMMUNICATIONS, v.15, no.1, 2024-02 |
Micromirror-Embedded Coverslip Assembly for Bidirectional Microscopic Imaging Lee, Dongwoo; Kim, Jihye; Song, Eunjoo; Jeong, Ji-Young; Jeon, Eun-chae; Kim, Pilhan; Lee, Wonhee, MICROMACHINES, v.11, no.6, 2020-06 |
Micromolding fabrication of biocompatible dry micro-pyramid array electrodes for wearable biopotential monitoring Alban, Marco Vinicio; Lee, Haechang; Moon, Hanul; Yoo, Seunghyup, FLEXIBLE AND PRINTED ELECTRONICS, v.6, no.4, 2021-12 |
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