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Showing results 212581 to 212600 of 276598
| Warming Up Your Tick-Tock: Temperature-Dependent Regulation of Circadian Clocks Ki, Yoonhee; Ri, Hwajung; Lee, Hoyeon; Yoo, Eunseok; Choe, Joonho; Lim, Chunghun, NEUROSCIENTIST, v.21, no.5, pp.503 - 518, 2015-10 |
| Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers 김준모; 이태익; 조우성; 조민수; 김택수, MPC2018 Fall Conference, 대한용접·접합학회, 2018-10-24 |
| Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 |
| Warpage analysis of electroplated Cu films on polymer based packaging core substrate 김철규; 이태익; 김민성; 김택수, MPC2014 Autumn Symposium, MPC, 2014-10-14 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
| Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
| Warpage prediction of chip package using simplified model of PCB substrate = PCB 기판의 단순화 모델을 통한 칩 패키지의 휨 예측link Kim, Junmo; Kim, Taek-Soo; et al, 한국과학기술원, 2019 |
| Warped dipole completed, with a tower of Higgs bosons Agashe, Kaustubh; Azatov, Aleksandr; Cui, Yanou; Randall, Lisa; Son, Minho, JOURNAL OF HIGH ENERGY PHYSICS, v.06, no.6, pp.196, 2015-06 |
| Warped Extra Dimensional Benchmarks for Snowmass 2013 Lee, SeungJoon, Snowmass Energy Frontier Workshop, University of Washington, Seattle, USA, 2013-07-02 |
| Warped linear prediction의 효율적 활용에 대한 연구 서성호; 장달원; 유창동, 음성통신 및 신호처리 학술대회, v.19, no.1, pp.123 - 126, 한국음향학회, 2002-08-24 |
| Warped seesaw mechanism is physically inverted Agashe, Kaustubh; Hong, Sungwoo; Vecchi, Luca, PHYSICAL REVIEW D, v.94, no.1, 2016-07 |
| Warped/composite phenomenology simplified Contino, Roberto; Kramer, Thomas; Son, Minho; Sundrum, Raman, JOURNAL OF HIGH ENERGY PHYSICS, no.5, 2007-05 |
| Warping and Partitioning for Low Error Shadow Maps Lloyd, Brandon; Tuft, David; Manocha, Dinesh; Yoon, Sung-Eui, Eurographics Symposium on Rendering, Eurographics Symposium on Rendering, 2006-07 |
| Warping effects in the band and angular-momentum structures of the topological insulator Bi2Te3 Jung, Wonsig; Kim, Yeong Kwan; Kim, Beomyoung; Koh, Yoonyoung; Kim, Chul; Matsunami, Masaharu; Kimura, Shin-ichi; et al, PHYSICAL REVIEW B, v.84, no.24, 2011-12 |
| Warping the Space: Weight Space Rotation for Class-Incremental Few-Shot Learningdl Kim, Do-Yeon; Han, Dong Jun; Jun Seo; Moon, Jaekyun, The International Conference on Learning Representations, ICLR 2023, ICLR, 2023-05-03 |
| Warping을 이용한 움직임 보상을 통한 3차원 의료 영상의 압축 소윤성; 조현덕; 김종효; 나종범, 대한의공학회지, v.18, no.3, pp.223 - 231, 1997-09 |
| Warping을 이용한 움직임 보상을 통한 3차원 의료 영상의 압축 나종범; 소윤성; 조현덕; 김종효, 대한의용생체공학회, pp.53 - 57, 대한의용생체공학회, 1997-04 |
| Warping을 이용한 움직임 보상을 통한 3차원 의료영상의 압축 = Interframe coding of 3-D medical image using warping predictionlink 소윤성; So, Yun-Sung; et al, 한국과학기술원, 1997 |
| Warping의 영향을 고려한 보의 기하학적 비선형 해석 곽, 효경, 1998-05 |
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