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Showing results 196821 to 196840 of 278078

196821
The Effect of Deposition Temperature on the Interfacial Properties of SiH4 Reduced Blanket Tungsten on TiN Glue Layer

천성순, 한국재료학회 추계학술발표(Korean J. Mat. Sci.), pp.86, 한국재료학회, 1993-11

196822
The Effect of Descaling Treatments on Intermetallic Formation and Thermomechanical Stability of an Electroplated Tin/Lead Layer in a Semiconductor Leadframe Alloy

y.g. kim; t.y. chung; t.j. cho, JOURNAL OF MATERIALS SCIENCE LETTERS, v.13, pp.1465 - 1468, 1994

196823
The effect of design parameter variation on tunnel deformation

Song, K.I; Cho, Gye-Chun; Sim, Y.J, The Seventeenth KKCNN Symposium on Civil Engineering, pp.631 - 636, 2004-12

196824
The effect of dexamethasone/cell-penetrating peptide nanoparticles on gene delivery for inner ear therapy

Yoon, Ji Young; Yang, Keum-Jin; Park, Shi-Nae; Kim, Dong-Kee; Kim, Jong-Duk, INTERNATIONAL JOURNAL OF NANOMEDICINE, v.11, pp.6123 - 6134, 2016

196825
The effect of dielectric constant and work function on triboelectric nanogenerators: Analytical and numerical study

Kim, Seong Min; Ha, Jaewook; Kim, Jin-Baek, INTEGRATED FERROELECTRICS, v.176, no.1, pp.251 - 256, 2016

196826
The effect of dielectric relaxation on DRAM operation

Lee, Hee Chul, pp.0 - 0, 1998-08-01

196827
The effect of different heat treatments on the luminescence efficiency of polymer light-emitting diodes

Lee, TW; Park, OOk, ADVANCED MATERIALS, v.12, no.11, pp.801 - 804, 2000-06

196828
The effect of different oil types on the dispersion stability and transdermal administration of lipid emulsion prepared by Microfluidizer

Lee, SJ; Yang, SR; Kim, Jong-Duk, 한국화학공학회 춘계학술발표회, pp.0 - 0, 한국화학공학회, 2003-04-01

196829
The effect of different oil types on the dispersion stability and transdermal administration of lipid emulsion prepared by Microfluidizer

Lee, SJ; Yang, SR; Kim, Jong-Duk, The 26th KSIEC Meeting, pp.0 - 0, KSIEC, 2002-11-01

196830
THE EFFECT OF DILUENT GAS AND RAPID THERMAL ANNEALING ON THE PROPERTIES OF PLASMA-DEPOSITED SILICON-NITRIDE FILMS

NAM, CW; Woo, Seong-Ihl; KIM, YT; MIN, SK, THIN SOLID FILMS, v.209, no.2, pp.215 - 222, 1992-03

196831
The Effect of Direct Contract Condensation on Passive Gravity Injection

No, Hee Cheon; Lee, Sang Il, 한국원자력학회 춘계발표회, pp.435 - 440, 1995

196832
The effect of direct fluorination of polydimethylsiloxane films on their surface properties

Lee, Sangyun A.; Oh, Sang Hyup; Lee, Woojin, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.332, no.2, pp.461 - 466, 2009-04

196833
The effect of direct x-ray on CMOS APS imager for industrial application

Kim, K.H.; Cho, Gyuseong, 2003 IEEE Nuclear Science Symposium Conference Record - Nuclear Science Symposium, Medical Imaging Conference, v.2, pp.1425 - 1429, 2003-10-19

196834
The effect of direct x-ray on CMOS APS imager for industrial application

Kim, Kwang Hyun; Cho, Gyuseong, IEEE NUCLEAR SCIENCE SYMPOSIUM CONFERENCE RECORD, v.2, no.0, pp.1425 - 1429, 2003

196835
The Effect of Discretization Order for Governing Equations on the Solution Accuracy

Dehee, Kim; Kwon, Jang-Hyuk, COMPUTATIONAL FLUID DYNAMICS JOURNAL, v.14, no.1, pp.12 - 22, 2005-04

196836
The Effect of Disordered Microscale Holes in the Front Dielectric Layer of AC Plasma Display Panels

Cho , Kwan-Hyun; Ahn, Sung-Il; Lee, Seong-Min; Choi, Kyung-Cheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.57, pp.2183 - 2189, 2010-09

196837
The effect of divalent metal ions on the zeta potential of bubbles

Han M.Y.; Ahn H.J.; Shin M.S.; Kim S.R., WATER SCIENCE AND TECHNOLOGY, v.50, no.8, pp.49 - 56, 2004

196838
The effect of DJs' social network on music popularity

Wi, Hyeongseok; Hyun, Kyung Hoon; Lee, Jongpil; Lee, Wonjae, 42nd International Computer Music Conference, ICMC 2016, pp.110 - 115, HKU University of the Arts Utrecht, HKU Music and Technology, 2016-09-15

196839
The effect of double counting, spin density, and Hund interaction in the different DFT plus U functionals

Ryee, Siheon; Han, Myung Joon, SCIENTIFIC REPORTS, v.8, pp.9559, 2018-06

196840
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

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