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Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer Jeong S.-J.; Shin Y.R.; Kwack W.S.; Lee H.W.; Jeong Y.K.; Kim D.I.; Kim H.C.; et al, SURFACE & COATINGS TECHNOLOGY, v.205, no.21-22, pp.5009 - 5013, 2011-08 |
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