Showing results 36601 to 36620 of 109486
Fabrication and characterization of ceramic sheet for the honeycomb by paper making method No, Kwangsoo, PACRIM3, PACRIM, 1998-01-01 |
Fabrication and Characterization of CNT/Al2O3 Nanocomposites by CVD Process 이빈; 구민영; 홍순형, 추계분말야금학회, pp.200 - 200, 추계분말야금학회, 2011-11-01 |
Fabrication and Characterization of CNT/Co Nanocomposite Field Emitters Hong, Soon-Hyung, Fall Meeting of Materials Research Society of Korea, 한국재료학회, 2006-11-03 |
Fabrication and Characterization of CNT/NiO NanocomPosite Powders Hong, Soon-Hyung, Fall Meeting of The Korean Institute of Metals and Materials, 금속재료학회, 2006-10-26 |
Fabrication and Characterization of Coercive Voltage Tunable Ferroelectric Memory Structure 이희철; 김우영, 제 18회 반도체 학술대회, 제 18회 반도체 학술대회, 2011 |
Fabrication and characterization of Conductive Films on Biaxial Ni Tapes for Superconductor Applications No, Kwangsoo, Korea-Japan Joint Workshop 2002 on Applied Superconductivity and Cryogenics, 2002-01-01 |
Fabrication and characterization of CuInS2-ZnS core-shell quantum dot/polymer composite Jeon, Duk Young, Joint Smposium on Materials Science and Engineering for the 21st Century, Joint Symposium on the Materials Science and Engineering for the 21st Century, 2010-06-28 |
Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) Lee, S; Hyun, JG; Pak, JS; Lee, H; Jeon, HS; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.742 - 746, 2008-05-27 |
Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages Park, Jong-Ho; Lee, Hanmin; Lee, Seyong; Kyung, Youjin; Kim, Jung Hak; Lee, Kwangjoo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.712 - 717, IEEE-CPMT, 2018-05-31 |
Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors Hyun, JG; Paik, Kyung-Wook; Pak, JS, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.124 - 128, 2008-10-22 |
Fabrication and characterization of Epoxy/BaTiO3 composite capacitor films for high frequency behaviors Hyun, JG; Lee, S; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 123, 2007-11-19 |
Fabrication and characterization of Er doped silicon-rich silicon nitride(SRSN) micro-disks Chang, J.S.; Kim, M.-K.; Lee, Y.-H.; Shin, JungHoon; Sung, G.Y., Optoelectronic Integrated Circuits X, 123, 2008-01-21 |
Fabrication and characterization of Er doped silicon-rich-silicon nitride(SRSN) microdisks Chang, J.S.; Lee, S.; Shin, J.H.; Shin, JungHoon; Sung, G.Y., 2007 4th International Conference on Group IV Photonics, GFP 2007, pp.276 - 278, 2007-09-19 |
Fabrication and Characterization of Ferroelectric Hafnia Using PEALD 성상현; 김도현; 이건재, 제26회 한국반도체학술대회, DB하이텍, 한국반도체산업협회, 한국반도체연구조합, 2019-02-15 |
Fabrication and Characterization of Ferroelectric Hafnium Oxide Thin Film 정유진; 성상현; 이건재, 제 29회 한국반도체학술대회, 대한전자공학회, 반도체공학회, 2022-01-25 |
Fabrication and Characterization of Ferroelectric Hafnium Oxide Thin Film Jeong, yujin; Sung, Sanghyeon; Lee, Keon Jae, 2022 MRS SPRING MEETING & EXHIBIT, Materials Research Society, 2022-05-10 |
Fabrication and Characterization of Ferroelectric/Oxide/Si Structures No, Kwangsoo, IMF, IMF, 1997-01-01 |
Fabrication and Characterization of Fixed-Nano-Abrasive Polishing Pads using Vertically Aligned Carbon Nanotubes Kang, Sukkyung; Kim, Sanha; Jeong, Ji-hun, International Conference on Planarization Technology, ICPT 2022, International Conference on Planarization Technology (ICPT), 2022-10-27 |
Fabrication and Characterization of Flexible Devices by using Laser Lift-off Technique 김승준; 이건재, 2014년 한국고분자학회 춘계학술대회, 한국고분자학회, 2014-04-10 |
FABRICATION AND CHARACTERIZATION OF FLUIDIC CHANNEL AND DISPENSING NOZZLE INTEGRATED MICROCANTILEVER HEATERS Ko, Juhee; Khan, Faheem; Lee, Bong Jae; Lee, Jungchul, 34th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp.845 - 847, IEEE, 2021-01 |
Discover