Browse by Type Conference

Showing results 22681 to 22700 of 109491

22681
CuO/ZnO/ZrO2와 제올라이트 혼성촉매의 상호작용과 CO2 수소화반응활성

Son Ki Ihm, , 2001-01-01

22682
CuOx/Al2O3 촉매를 이용한 페놀의 습식산화: 활성점 규명, Cu의 최적 담지량

Son Ki Ihm, 한국공업화학회 2004 추계학술대회, 2004-10-29

22683
CuOx/TiO2 촉매에 의한 페놀의 촉매습식산화

Son Ki Ihm, 대한환경공학회 2005 추계학술대회, 2005-11-04

22684
Cupper Recovery from Industrial Wastes in a Circulating Three Phase Fluidized Bed

김상돈, Appl. Theor. Chem. Eng., pp.874 - 874, 2003

22685
Cupping Artifacts Reduction for Synthetic Mammograms by Sine Function Addition

Kim, Hyeongseok; Lee, Taewon; Min, Jonghwan; Son, Kihong; Sohail Sabir; Cho, Sanghoon; Cho, Seungryong, International Forum On Medical Imaging In Asia 2017, IFMIA, 2017-01-20

22686
Cuprate Superconductivity and Multi-Dimensional Scanning Tunneling Spectroscopy

Lee, Jhinhwan, Korea-UK Workshop on Strongly Correlated Electron Systems, 서울대학교, 2011-02-14

22687
CUP차트를 이용한 정보통신 서비스의 동적 경쟁 분석

안재현; 이동주; 김명수, 한국경영과학회 추계학술대회, pp.209 - 212, 한국경영과학회, 2001-10

22688
Cure monitoring of composite laminate using a fiber Bragg grating sensor

Yoon, HJ; Kim, Chun-Gon, KAIST/Doshisha Univ./Nihon Univ. Joint Workshop on Composite materials 2005, Korea Advanced Institute of Science and Technology, 2005-03-29

22689
Cure Monitoring of Composite Laminates Using Fiber Optic Sensors

강현규; 강동훈; 박형준; 홍창선; 김천곤; 방형준, 복합재료학회 한일 조인트 세션, pp.179 - 184, 복합재료학회, 2001-10

22690
Cure Monitoring of Thermosetting Resin Composites by Lacomtech Dielectrometry

Kwon, JW; Lee, Dai Gil, International Conference on Composite Materials, 2001

22691
Cure monitoring using long pulse and high power laser

Truong, Thanh Chung; Ahmed, Hassan; 이정률, 2017년도 항공우주학회 추계학술대회, 한국항공우주학회, 2017-11

22692
CURE: An Efficient Clustering Algorithm for Large Databases

Shim Kyuseok, ACM SIGMOD International Conference on Management of Data, 1998

22693
Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection

Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30

22694
Curing and Phase Separation Behavior of ATBN Modified Epoxy

김성철, 한국복합재료학회 춘계학술발표회, pp.20 -, 1989

22695
Curing and Phase Separation in Rubber-Modified Epoxy

김성철, 한국고분자학회 추계학술발표회, pp.20 -, 1990

22696
Curing characteristics of polyimide on temperatures

Kim, SM; Koo, YM; Kim, Jong-Duk, 한국화학공학회 춘계학술발표회, pp.0 - 0, 한국화학공학회, 1994-04-29

22697
Curing characteristics of polyimides on temperatures

Kim, SM; Koo, YM; Kim, Jong-Duk, 1994 한국고분자학회 춘계학술발표회, pp.0 - 0, 한국고분자학회, 1994-04-16

22698
Curing of SMC in Molds with Substructures

Fan, J.D; Lee, L.J; Kim, J; Im, Yong-Taek, The Annual conf., SPI Composites , pp.1 - 12, 1989-12

22699
Curing of Unsaturated Polyester Using Recycled Poly(ethylene terephthalate)

서덕종; 길승범; 윤관한; 박오옥, 한국고분자학회 추계학술발표회, pp.332 - 332, 한국고분자학회, 1997

22700
Curiosity or Certainty?: A Qualitative, Comparative Analysis of Couchsurfing and Airbnb User Behaviors

Jung, Jiwon; Lee, Kun-Pyo, 2017 ACM SIGCHI Conference on Human Factors in Computing Systems, CHI EA 2017, pp.1740 - 1747, Association for Computing Machinery, 2017-05

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