Browse by Title 

Showing results 125061 to 125080 of 276341

125061
Measurement of the Thermal Expansion for Space Structures Using Fiber Bragg Grating Sensors and Displacement Measuring

Kim, H.-I.; Kang, L.-H.; Han, Jae-Hung, ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems, SMASIS2008, pp.387 - 395, American Society of Mechanical Engineers, 2008-10-30

125062
Measurement of the thermal expansion of space structures using fiber Bragg grating sensors and displacement measuring interferometers

Kim, Hong-Il; Yoon, Jae-San; Kim, Hong-Bae; Han, Jae-Hung, MEASUREMENT SCIENCE TECHNOLOGY, v.21, no.8, 2010-08

125063
Measurement of the thermo-optic coefficients in sol-gel derived inorganic-organic hybrid material films

Kang, Eun-Seok; Lee, Tae-Ho; Bae, Byeong-Soo, APPLIED PHYSICS LETTERS, v.81, no.8, pp.1438 - 1440, 2002-08

125064
Measurement of the thickness profile of a transparent thin film deposited upon a pattern structure with an acousto-optic tunable filter

Kim, D; Kim, Soohyun; Kong, Hong-Jin; Lee, Y, OPTICS LETTERS, v.27, no.21, pp.1893 - 1895, 2002-11

125065
Measurement of the voltage evolution on a load of X-pinch plasma system using the Pockels effect

Choi, Seongmin; Ham, Seunggi; Ryu, Jonghyeon; Park, Sungbin; Kim, Jung-Hwa; Choi, YeongHwan; Chung, Kyoung-Jae; et al, JOURNAL OF INSTRUMENTATION, v.18, no.11, 2023-11

125066
Measurement of Thermal Coductivities on SiN and TbFeCo Films

Kim, SS; Ahn, YM; Lee, KG; Gill, BL; Jang, YK; Shin, Sung-Chul, INTERMAG, pp.BS-05 -, 1996

125067
Measurement of thermal conductivities of SiN and TbFeCo films

Kim, SS; Ahn, YM; Lee, KG; Gill, BL; Shin, Sung-Chul, IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.4095 - 1, 1996-09

125068
Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry

Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001

125069
Measurement of Thermal Deformations of Electronic packages using Moire Interferometry

Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000

125070
Measurement of Thermal Diffusion Parameters of Polystyrene Using a Thermal Field Flow Fractionation Method

K.C. Song; E.K. Kim; I.J. Chung, THE KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.3, no.2, pp.171 - 175, 1986

125071
Measurement of thermal diffusivity of ion nitrided steel by flash method = 섬광 열확산 방법에 의한 이온 질화강의 열확산 계수 측정link

Lee, Sang-Kil; 이상길; Lee, Chung-Oh; Lee, Hung-Joo; et al, 한국과학기술원, 1979

125072
Measurement of Thermal Diffusivity of Ion-Nitrided Steel by Flash Method,

s.k.lee; h.j.lee; c.o.lee, 대한기계학회논문집, v.3, no.4, 1979

125073
Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate

Lee, TI; Kim, C; Kim, MS; 김택수, 2014 KSPE Fall Meeting, KSPE, 2014-10-29

125074
Measurement of thermal expansion coefficient of poly-si using microgauge sensors

Chae J.-H.; Lee J.-Y.; Kang S.-W., Smart Electronics and MEMS, v.3242, pp.202 - 211, 1997-12-11

125075
Measurement of thermal expansion coefficient of poly-Si using microgauge sensors

Chae, Jung-Hun; Lee, Jae-Youl; Kang, Sang-Won, SPIE Vol. 3242, pp.202-211, 1997

125076
Measurement of thermal expansion coefficient of poly-Si using microgauge sensors

Chae, JH; Lee, JY; Kang, Sang-Won, SENSORS AND ACTUATORS A-PHYSICAL, v.75, no.3, pp.222 - 229, 1999-06

125077
Measurement of thermal properties of liquid analytes using microfluidic resonators via photothermal modulation

Abraham, Rosmi; Yoon, Yeowon; Khan, Faheem; Bukhari, Syed A.; Kim, Chun-il; Thundat, Thomas; Chung, Hyun-Joong; et al, SENSORS AND ACTUATORS A-PHYSICAL, v.347, 2022-11

125078
Measurement of thermo-optic coefficients in sol-gel hybrid glass films

Kang, ES; Bae, JY; Bae, Byeong-Soo, JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY, v.26, no.1-3, pp.981 - 984, 2003-01

125079
Measurement of thermodynamic properties and cycle analysis of new working fluids used in air-cooled absorption heat pump = 공냉형 흡수식 냉방기에 사용되는 신용액의 물성 측정 및 분석link

Park, Young; 박영; et al, 한국과학기술원, 1997

125080
Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry

Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, SEM'04, 2004

rss_1.0 rss_2.0 atom_1.0