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Fabrication of high-quality single-crystal Cu thin films using radio-frequency sputtering Lee, Seunghun; Kim, Ji Young; Lee, Tae-Woo; Kim, Won-Kyung; Kim, Bum-Su; Park, Ji Hun; Bae, Jong-Seong; et al, SCIENTIFIC REPORTS, v.4, 2014-08 |
Low Temperature Two-Step Atomic Layer Deposition of Tantalum Nitride for Cu Diffusion Barrier Kwon J.-D.; Jeong S.-J.; Kang J.-W.; Kim D.-G.; Kim J.-K.; Rha J.-J.; Nam K.-S.; et al, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.156, no.11, pp.H832 - H835, 2009 |
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