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Showing results 83441 to 83460 of 101054

83441
Thermal stability of the exchanged biased CoFe/IrMn electrode for the magnetic tunnel junction as a function of CoFe thickness

Lee, JH; Kim, SJ; Yoon, CS; Kim, CK; Park, Byong Guk; Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.92, no.10, pp.6241 - 6244, 2002-11

83442
Thermal Stability of the Multiple Isoforms of Inulase from Aspergillus niger

Uhm T. B.; Kwon Y. J.; Han S. B.; Byun, Si Myung, BIOTECHNOLOGY LETTERS, v.9, no.4, pp.287 - 290, 1987

83443
Thermal stability of TiAlN/CrN multilayer coatings studied by atom probe tomography

Choi, Pyuck-Pa; Povstugar, Ivan; Ahn, Jae-Pyeong; Kostka, Aleksander; Raabe, Dierk, ULTRAMICROSCOPY, v.111, no.6, pp.518 - 523, 2011-05

83444
Thermal stability study of BaAl2Si2O8 : Eu2+ phosphor using its polymorphism for plasma display panel application

Im, WB; Kim, YI; Jeon, DukYoung, CHEMISTRY OF MATERIALS, v.18, no.5, pp.1190 - 1195, 2006-03

83445
Thermal stability study of Si cap/ultrathin Ge/Si and strained Si/Si1-xGex/Si nMOSFETs with HfO2 gate dielectric

Yeo, CC; Cho, Byung Jin; Lee, MH; Liu, CW; Choi, KJ; Lee, TW, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.21, no.5, pp.665 - 669, 2006-05

83446
Thermal stabilization for accurate dimensional measurement using gallium

Keem, T; Kim, Seung-Woo, INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, v.44, no.7-8, pp.701 - 706, 2004-06

83447
Thermal Stabilization of Aspergillus Phytase by L-Arginine

Ryu, S; Park, Tae Gwan, BIOTECHNOLOGY AND BIOPROCESS ENGINEERING, v.3, no.0, pp.32 - 34, 1998-05

83448
Thermal stress analysis in structural elements of HRSG casing

Shin, Hyuntae; Kim, Daehee; Ahn, Hyungjun; Choi, Sangmin; Myoung, Gichul, International Journal of Energy Engineering, v.2, no.5, pp.202 - 209, 2012

83449
Thermal stress analysis of silo in radioactive waste repository considering construction conditions

Cha, Sang Lyul; Lee, Yun; Kim, Jin-Keun, NUCLEAR ENGINEERING AND DESIGN, v.322, pp.412 - 426, 2017-10

83450
Thermal stress and fatigue analysis of exhaust manifold

Yoon, S.; Lee, K.O.; Lee, Soon-Bok; Park, K.H., ADVANCES IN FRACTURE AND FAILURE PREVENTION, PTS 1 AND 2 Book Series: KEY ENGINEERING MATERIALS, v.261-263, no.II, pp.1203 - 1208, 2004

83451
Thermal stress in silica-on-silicon disk resonators

Chen, Tong; Lee, Hansuek; Vahala, Kerry J., APPLIED PHYSICS LETTERS, v.102, no.3, 2013-01

83452
Thermal suppression of high-repetition rate SBS pulse compression in liquid media

Wang, Hongli; Cha, Seongwoo; Kong, Hong jin; Wang, Yulei; Lu, Zhiwei, OPTICS EXPRESS, v.30, no.21, pp.38995 - 39013, 2022-10

83453
Thermal transfer behavior in two types of W-shape ground heat exchangers installed in multilayer soils

Yoon, Seok; Lee, Seung Rae; Go, Gyughyun; Xue, Jianfeng; Park, Hyunku; Park, Dowon, GEOMECHANICS AND ENGINEERING, v.6, no.1, pp.79 - 98, 2014-01

83454
Thermal Transformation of Molecular Ni2+-N-4 Sites for Enhanced CO2 Electroreduction Activity

Sa, Young Jin; Jung, Hyejin; Shin, Dongyup; Jeong, Hu Young; Ringe, Stefan; Kim, Hyungjun; Hwang, Yun Jeong; et al, ACS CATALYSIS, v.10, no.19, pp.10920 - 10931, 2020-10

83455
Thermal transport in layer-by-layer assembled polycrystalline graphene films

Estrada, David; Li, Zuanyi; Choi, Gyung-Min; Dunham, Simon N.; Serov, Andrey; Lee, Jungchul; Meng, Yifei; et al, Npj 2d Materials and Applications, v.3, 2019-03

83456
Thermal transport properties of thin films of small molecule organic semiconductors

Kim, N; Domercq, B; Yoo, Seunghyup; Christensen, A; Kippelen, B; Graham, S, APPLIED PHYSICS LETTERS, v.87, no.24, 2005-12

83457
Thermal Unimolecular Decomposition Reactions of Ethyl Bromide at 724.5-755.1$^o$K

t.j. park; Jung, Kyung Hoon, BULLETIN OF THE KOREAN CHEMICAL SOCIETY, v.1, pp.30, 1980

83458
Thermal wetting of platinum nanocrystals on silica surface

Yu R.; Song, Hyunjoon; Zhang X.-F.; Yang P., JOURNAL OF PHYSICAL CHEMISTRY B, v.109, no.15, pp.6940 - 6943, 2005

83459
THERMAL-ANALYSIS OF HYDROGENATED AMORPHOUS-CARBON FILMS PREPARED BY PLASMA ENHANCED CHEMICAL VAPOR-DEPOSITION

M.H. Kim; Lee, Jai Young, JOURNAL OF MATERIALS SCIENCE, v.26, no.17, pp.4787 - 4794, 1991

83460
THERMAL-ANALYSIS OF MAGNETOOPTICAL THIN-FILMS UNDER LASER IRRADIATION

Shin, Sung-Chul, JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, v.61, no.3, pp.301 - 306, 1986-10

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