Showing results 1 to 6 of 6
An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection Aryan, Pouria; Sampath, Santhakumar; Sohn, Hoon, SENSORS, v.18, no.7, 2018-07 |
Automated detection and quantification of hidden voids in triplex bonding layers using active lock-in thermography Song, Homin; Lim, Hyung Jin; Lee, Sangmin; Sohn, Hoon; Yun, Wonjun; Song, Eunha, NDT & E INTERNATIONAL, v.74, pp.94 - 105, 2015-09 |
Autonomous mobile lock-in thermography system for detecting and quantifying voids in liquefied natural gas cargo tank second barrier Lee, Sangmin; Lim, Hyung Jin; Sohn, Hoon; Yun, Wonjun; Song, Eunha, STRUCTURAL HEALTH MONITORING-AN INTERNATIONAL JOURNAL, v.16, no.3, pp.276 - 290, 2017-05 |
Experimental investigations of heat transfer mechanisms of a pulsating heat pipe Jo, Jaeyeong; Kim, Jungho; Kim, Sung Jin, ENERGY CONVERSION AND MANAGEMENT, v.181, pp.331 - 341, 2019-02 |
Impact localization on a composite stiffened panel using reference signals with efficient training process Jang, Byeong-Wook; Kim, Chun-Gon, COMPOSITES PART B-ENGINEERING, v.94, pp.271 - 285, 2016-06 |
Thermography-based coating thickness estimation for steel structures using model-agnostic meta-learning Lee, Jun; Hwang, Soonkyu; Kim, Kiyoung; Sohn, Hoon, SMART STRUCTURES AND SYSTEMS, v.32, no.2, pp.123 - 133, 2023-08 |
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