Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip

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A method to measure the tensile adhesion of thin films on a silicon chip was developed. A new test machine was designed to obtain tensile adhesion by applying a single cantilever beam method. Self-alignment of the specimen was accomplished by a specially designed jig and mount. The specimen was designed to allow fabrication by using a commercial manufacturing process. The developed method was applied to measure the adhesion of die attach films having various thicknesses ranging from 5 mu m to 20 mu m. Adhesion between the film adhesive and the top surface of a silicon chip was successfully measured. It was shown that the measured adhesion was independent of crack length and robust against variation of the initial alignment of specimen.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
2015-01
Language
English
Article Type
Article
Keywords

PACKAGES; SPECIMEN; STRENGTH

Citation

ENGINEERING FRACTURE MECHANICS, v.133, pp.179 - 190

ISSN
0013-7944
DOI
10.1016/j.engfracmech.2014.10.004
URI
http://hdl.handle.net/10203/195445
Appears in Collection
ME-Journal Papers(저널논문)
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