DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, DongKil | ko |
dc.contributor.author | Lee, Jung-Ju | ko |
dc.contributor.author | Yoon, ChulKeun | ko |
dc.contributor.author | Lee, GyuJei | ko |
dc.contributor.author | Hong, JoonKi | ko |
dc.contributor.author | Kim, NamSuk | ko |
dc.date.accessioned | 2015-04-08T02:24:52Z | - |
dc.date.available | 2015-04-08T02:24:52Z | - |
dc.date.created | 2015-03-03 | - |
dc.date.created | 2015-03-03 | - |
dc.date.issued | 2015-01 | - |
dc.identifier.citation | ENGINEERING FRACTURE MECHANICS, v.133, pp.179 - 190 | - |
dc.identifier.issn | 0013-7944 | - |
dc.identifier.uri | http://hdl.handle.net/10203/195445 | - |
dc.description.abstract | A method to measure the tensile adhesion of thin films on a silicon chip was developed. A new test machine was designed to obtain tensile adhesion by applying a single cantilever beam method. Self-alignment of the specimen was accomplished by a specially designed jig and mount. The specimen was designed to allow fabrication by using a commercial manufacturing process. The developed method was applied to measure the adhesion of die attach films having various thicknesses ranging from 5 mu m to 20 mu m. Adhesion between the film adhesive and the top surface of a silicon chip was successfully measured. It was shown that the measured adhesion was independent of crack length and robust against variation of the initial alignment of specimen. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | PACKAGES | - |
dc.subject | SPECIMEN | - |
dc.subject | STRENGTH | - |
dc.title | Development of single cantilever beam method to measure the adhesion of thin film adhesive on silicon chip | - |
dc.type | Article | - |
dc.identifier.wosid | 000348580000014 | - |
dc.identifier.scopusid | 2-s2.0-84920877188 | - |
dc.type.rims | ART | - |
dc.citation.volume | 133 | - |
dc.citation.beginningpage | 179 | - |
dc.citation.endingpage | 190 | - |
dc.citation.publicationname | ENGINEERING FRACTURE MECHANICS | - |
dc.identifier.doi | 10.1016/j.engfracmech.2014.10.004 | - |
dc.contributor.localauthor | Lee, Jung-Ju | - |
dc.contributor.nonIdAuthor | Shin, DongKil | - |
dc.contributor.nonIdAuthor | Yoon, ChulKeun | - |
dc.contributor.nonIdAuthor | Lee, GyuJei | - |
dc.contributor.nonIdAuthor | Hong, JoonKi | - |
dc.contributor.nonIdAuthor | Kim, NamSuk | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Tensile adhesion | - |
dc.subject.keywordAuthor | Single cantilever beam | - |
dc.subject.keywordAuthor | Shear strength | - |
dc.subject.keywordAuthor | Die attach film | - |
dc.subject.keywordAuthor | Electronic package | - |
dc.subject.keywordPlus | PACKAGES | - |
dc.subject.keywordPlus | SPECIMEN | - |
dc.subject.keywordPlus | STRENGTH | - |
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