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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analysis of the Vertical Electromagnetic Bandgap Structures in the Power Distribution Network for the Multi-layer Printed Circuit Board

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Yoo, Jeongsik / Park, Hyunjeong / Park, Jongbae / Kim, Junchul / Shim, Yujeong / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2009-01-27
Language
English
Citation

IEEE Electronics Packaging Technology Conference, EPTC, pp.1381 - 1386

URI
http://hdl.handle.net/10203/18677
Appears in Collection
EE-Conference Papers(학술회의논문)
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