Effect of Cooling Rate on the Microstructures and Mechanical Properties of Sn-Ag-Cu Lead-free Solder Joints on Cu Substrate
- Issue Date
- 2002-10-20
- Language
- ENG
- Citation
The 65th World Foundry Congress, pp.565 - 571
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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