Effect of Cooling Rate on the Microstructures and Mechanical Properties of Sn-Ag-Cu Lead-free Solder Joints on Cu Substrate
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyuck Mo | - |
| dc.contributor.author | Jeong, SW | - |
| dc.date.accessioned | 2013-03-16T13:32:00Z | - |
| dc.date.available | 2013-03-16T13:32:00Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2002-10-20 | - |
| dc.identifier.citation | The 65th World Foundry Congress, v., no., pp.565 - 571 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/131782 | - |
| dc.language | ENG | - |
| dc.title | Effect of Cooling Rate on the Microstructures and Mechanical Properties of Sn-Ag-Cu Lead-free Solder Joints on Cu Substrate | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 565 | - |
| dc.citation.endingpage | 571 | - |
| dc.citation.publicationname | The 65th World Foundry Congress | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Hyuck Mo | - |
| dc.contributor.nonIdAuthor | Jeong, SW | - |
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