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Showing results 8 to 10 of 10

8
Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration

Jeong, Jaeyong; Kim, Seong Kwang; Kim, Jongmin; Geum, Dae-Myeong; Park, Juyeong; Jang, Jae-Hyung; Kim, Sanghyeon, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.68, no.5, pp.2205 - 2211, 2021-05

9
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion

Jeong, Jaeyong; Kim, Seongkwang; Suh, Yoonje; Shim, Joonsup; Beak, Woo Jin; Choi, Sung Joon; Kim, Joon Pyo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024-06

10
실리콘 웨이퍼 접합을 위한 코발트-주석 금속간화합물에 관한 연구 = A study on the Co-Sn IMCs for the silicon wafer bondinglink

김성환; Kim, Sung-Hwan; et al, 한국과학기술원, 2008

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