Showing results 1 to 5 of 5
A study on characteristics and processing parameters of photo-patternable adhesives for MEMS Motion Sensor Wafer Bonding = MEMS 모션센서 웨이퍼 본딩을 위한 감광성 접착제의 특성과 공정변수에 관한 연구link Kim, Jong-Hyun; 김종현; et al, 한국과학기술원, 2011 |
Electrical Analysis for Wafer-Bonded Interfaces of p(+)GaAs/n(+)InGaAs and p(+)InGaAs/n(+)InGaAs Geum, Dae-Myeong; Kim, Seong Kwang; Lim, Hyeong-Rak; Park, Juhyuk; Jeong, Jaeyong; Han, Jae Hoon; Choi, Won Jun; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.6, pp.800 - 803, 2021-06 |
Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications Kim, Sanghyeon; Han, Jae-Hoon; Choi, Won Jun; Song, Jin Dong; Kim, Hyung-jun, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.74, no.2, pp.82 - 87, 2019-01 |
Real-time 3D plane-wave imaging using annular capacitive micromachined ultrasonic transducer array Kwon, Young Seok; Kim, Hae Youn; Kang, Dong-Hyun; Kim, Dong Hun; Jeong, Jae-Woong; Lee, Byung Chul, SENSORS AND ACTUATORS A-PHYSICAL, v.359, 2023-09 |
웨이퍼 접합 시험에서의 파괴역학적 응용 연구 = An application of fracture mechanics to wafer bonding testlink 문호정; Moon, Ho-Jeong; et al, 한국과학기술원, 1998 |
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