웨이퍼 접합 시험에서의 파괴역학적 응용 연구An application of fracture mechanics to wafer bonding test
- Description
- 한국과학기술원 : 기계공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1998
- Identifier
- 143405/325007 / 000925118
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 기계공학과, 1998.8, [ ix, 108 p. ]
- Keywords
블레이드 시험; T-응력; 양극 접합; 웨이퍼 접합; 계면파괴인성치; Interfacial fracture toughness; Blade test; T-stress; Anodic bonding; Wafer bonding
- Appears in Collection
- ME-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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