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Enhancement of adhesion strength of electroless-plated Ni under bump metallurgy by introduction of inductively coupled plasma enhanced bias sputtering Ni seed layer Kim, ED; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.44, no.50-52, pp.1541 - 1543, 2005-12 |
UBM용 Ni 박막 형성 및 특성에 관한 연구 = Fabrication and characterization of the Ni films for the Applications to UBMlink 김응도; Kim, Eung-Do; et al, 한국과학기술원, 2005 |
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