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Showing results 1 to 35 of 35
| Atomic Layer Deposition of Aluminum Thin Films Using an Alternating Supply of Trimethylaluminum and a Hydrogen Plasma Lee, Yong Ju; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.5, no.10, pp.C91 - C93, 2002-08 |
| Atomic layer deposition of ruthenium thin films for copper glue layer Kwon, OK; Kim, JH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.2, pp.G109 - G112, 2004-01 |
| Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene) Lee, WH; Ko, YK; Byun, IJ; Seo, BS; Lee, JG; Reucroft, PJ; Lee, JU; et al, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.19, no.6, pp.2974 - 2978, 2001-11 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Rha, SY; Lee, SY; Kim, DW; Park, Chong-Ook, THIN SOLID FILMS, v.305, pp.254 - 258, 1997-01 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Effects of graphene oxide on the electromigration lifetime of lead-free solder joints Ko, Yong Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek-Soo, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.3, pp.2334 - 2341, 2019-02 |
| Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06 |
| Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Choi, WK, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.7, pp.790 - 795, 2004-07 |
| Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 |
| Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10 |
| Fabrication of TiN/cBN and TiC/diamond coated particles by titanium deposition process Daoush, Walid M.; Park, Hee S.; Hong, Soon-Hyung, TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, v.24, no.11, pp.3562 - 3570, 2014-11 |
| Fermi-Level Unpinning Technique with Excellent Thermal Stability. for n-Type Germanium Kim, Gwang-Sik; Kim, Seung-Hwan; Lee, Tae In; Cho, Byung Jin; Choi, Changhwan; Shin, Changhwan; Shim, Joon Hyung; et al, ACS APPLIED MATERIALS & INTERFACES, v.9, no.41, pp.35988 - 35997, 2017-10 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Formation of hillocks in Pt/Ti electrodes and their effects on short phenomena of PZT films deposited by reactive sputtering Nam, HJ; Choi, DK; Lee, Won-Jong, THIN SOLID FILMS, v.371, no.1-2, pp.264 - 271, 2000-08 |
| Frequency and voltage dependent dielectric properties of Ni-doped Ba0.6Sr0.4TiO3 thin films Ryu, HC; Lee, SJ; Lim, MH; Kim, HS; Kim, NY; Kim, Ho Gi; Kim, Il-Doo; et al, JOURNAL OF ELECTROCERAMICS, v.13, pp.239 - 243, 2004-07 |
| Improvement of Surface Morphology of Aluminum Thin Films Grown by Metallorganic Chemical Vapor Deposition Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.3, no.4, pp.186 - 188, 2000-04 |
| Initial stages of ruthenium film growth in plasma-enhanced atomic layer deposition Kwon, Se-Hun; Kwon, Oh-Kyum; Kim, Jin-Hyock; Oh, Heung-Ryong; Kim, Kwang-Ho; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp.H296 - H300, 2008-03 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial Reactions and Joint Strengths of Sn-xZn Solders with Immersion Ag UBM Jee, YK; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.10, pp.2286 - 2291, 2010-10 |
| Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12 |
| MOCVD of Titanium Nitride from a New Precursor Ti[N(CH3)C2H5]4 Shin, HK; Shin, HJ; Lee, JG; Kang, SW; Ahn, Byung Tae, CHEMISTRY OF MATERIALS, v.9, no.1, pp.76 - 80, 1997-01 |
| Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study Jang, SY; Wolf, J; Ehrmann, O; Reichl, H; Paik, Kyung-Wook, MICROSYSTEM TECHNOLOGIES, v.7, no.5-6, pp.269 - 272, 2002-01 |
| Photochemical Deposition of ZnS From Gas Phase and Simultaneous Luminescence Detection of Photofragments from a Single source Precursor Zn[S$_2$COCGMe$_2$]$_2$ Cheon,J.; Talaga, D.S.; Zink, J.I, JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, v.119, no.1, pp.163 - 168, 1997 |
| Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals Kwon, SH; Kwon, OK; Min, JS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.6, pp.G578 - G581, 2006 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02 |
| Study on the characteristics of aluminuim thin films prepared by atomic layer deposition Sang-Won Kang, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, v.20, no.6, pp.1983 - 1988, 2002-11 |
| Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
| Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06 |
| Texture and sheet resistance of Al alloy thin films on Ti and TiN thin films Lee, WJ; Kim, SJ; Lee, WH; Lee, YJ; Lee, YS; Rha, SK; Park, Chong-Ook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.15, no.1, pp.9 - 13, 2004-01 |
| THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09 |
| TiN barrier layer formation by the two-step rapid thermal conversion process Kim, YT; Jun, CH; Lee, JH; Baek, JT; Joun, H; Yoo, Hyung Joun, JOURNAL OF VACUUM SCIENCE TECHNOLOGY A-VACUUM SURFACES AND FILMS, v.14, no.6, pp.3245 - 3251, 1996 |
| Transformer coupled plasma enhanced metal organic chemical vapor deposition of Ta(Si)N thin films and their Cu diffusion barrier properties Park, HL; Byun, KM; Lee, Won-Jong, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.41, no.10, pp.6153 - 6164, 2002-10 |
| Tungsten alloying of the Ni(P) films and the reliability of Sn-3.5Ag/NiWP solder joints Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.7, pp.889 - 895, 2011-04 |
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