DSpace at KOASAS
Browsing DSpace

Browse by Subject double layer

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 5 of 5

1
A Study on Double Layer Non-Conductive Films (D-NCFs) for 3D-Through Silicon Via (TSV) Interconnection using Cu-pillar/SnAg Micro-Bump = 3D-Through Silicon Via (TSV) 미세피치 Cu-pillar/SnAg Micro-Bump 접속용 이중층 비전도 접속 필름 연구link

Se Yong, Lee; Paik, Kyoung Wook; et al, 한국과학기술원, 2018

2
Effect of deposition temperature on the crystallization mechanism of amorphous silicon films on glass

Lee, JN; Lee, BJ; Moon, DG; Ahn, Byung Tae, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.11, pp.6862 - 6866, 1997-11

3
Highly Stable AlInZnSnO and InZnO Double-Layer Oxide Thin-Film Transistors With Mobility Over 50 cm(2)/ V.s for High-Speed Operation

Yang, Jong Heon; Choi, Ji Hun; Cho, Sung Haeng; Pi, Jae-Eun; Kim, Hee-Ok; Hwang, Chi-Sun; Park, KeeChan; et al, IEEE ELECTRON DEVICE LETTERS, v.39, no.4, pp.508 - 511, 2018-04

4
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

5
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

Discover

rss_1.0 rss_2.0 atom_1.0