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Results 1-10 of 32 (Search time: 0.012 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Sooresearcher, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06

2
Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device

Kim, Seung-Yoon; Bong, Jae Hoon; Kim, Cheolgyu; Hwang, Wan Sik; Kim, Taek-Sooresearcher; Cho, Byung Jinresearcher, ADVANCED MATERIALS INTERFACES, v.4, no.21, 2017-11

3
Reversible self-bending soft hydrogel microstructures with mechanically optimized designs

Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Sooresearcher; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08

4
A quantitative strain analysis of a flexible single-crystalline silicon membrane

Bong, Jae Hoon; Kim, Cheolgyu; Hwang, Wan Sik; Kim, Taek-Sooresearcher; Cho, Byung Jinresearcher, APPLIED PHYSICS LETTERS, v.110, no.3, 2017-01

5
Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality

Han, Yujin; Han, Hyeuk Jin; Rah, Yoonhyuk; Kim, Cheolgyu; Kim, Moohyum; Lim, Hunhee; Ahn, Kwang Ho; Jang, Hanhwi; Yu, Kyoungsikresearcher; Kim, Taek-Sooresearcher; Cho, Eugene N.; Jung, Yeon Sikresearcher, ADVANCED MATERIALS, v.32, no.38, pp.2002099, 2020-09

6
Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit

Kim, Seungyoon; Kim, Cheolgyu; Bong, Jae Hoon; Hwang, Wan Sik; Kim, Taek-Sooresearcher; Oh, Jae Sub; Cho, Byung Jinresearcher, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.19, no.10, pp.6473 - 6480, 2019-10

7
최적화된 Zn Diffusion 과 p-type Ohmic Contact 공정을 이용한 광통신용 Planar-type InGaAs/InP Avalanche Photodiode 의 제작 및 특성 분석 = Fabrication and Characterization of Planar-type InGaAs/InP Avalanche Photodiodes using Optimized Zn Diffusion and p-type Ohmic Contact for Optical Communicationslink

김철규; Kim, Cheol-Gyu; 양경훈researcher; Yang, Kyoung-Hoon, 한국과학기술원, 2011

8
FE Analysis of Three-Layered Biomimetic Skin Pad for Prosthetic Hands

Heo, Si-Hwan; Kim, Cheolgyu; Kim, Dong Hyun; Kim, Taek-Sooresearcher; Park, Hyung-Soonresearcher, 10th International Symposium on Nature-Inspired Technology, 대한기계학회, 2017-06-29

9
Design of ultrathin OLEDs having oxide -based transparent electrodes and encapsulation with sub -mm bending radius

Kim, Eungjun; Kwon, Jeonghyun; Kim, Cheolgyu; Kim, Taek-Sooresearcher; Choi, Kyung Cheolresearcher; Yoo, Seunghyupresearcher, ORGANIC ELECTRONICS, v.82, 2020-07

10
FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing

Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Sooresearcher, 2017 International Conference on Electronics Packaging, ICEP 2017, pp.422 - 423, Institute of Electrical and Electronics Engineers Inc., 2017-04-21

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