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Results 1-10 of 76 (Search time: 0.014 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC

Choi, Sumin; Kim, Jounghoresearcher; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

2
Antitumor Efficacy of Focused Ultrasound-MFL Nanoparticles Combination Therapy in Mouse Breast Cancer Xenografts

Kim, Daehyun; Han, Junhee; Park, So Yeon; Kim, Heegon; Park, Ji-Horesearcher; Lee, Hak Jong, MATERIALS, v.13, no.5, 2020-03

3
Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link

Kim, Dong-Hyun; Kim, Jounghoresearcher; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19

4
Power Distribution Network (PDN) Design and Analysis of A Single and Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System

Cho, Kyungjun; Kim, Jounghoresearcher; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27

5
A Fast and accurate statistical eye-diagram estimation method for high-speed channel including non-linear receiver circuit = 비선형 수신 회로를 포함한 고속 채널에서의 빠르고 정확한 통계 아이다이어그램 예측 기법link

Kim, Heegon; 김희곤; Kim, Joung Horesearcher; 김정호, 한국과학기술원, 2015

6
Design and Measurement of a Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Differential Signaling

Kim, Jounghoresearcher; Kim, Heegon; Cho, Jonghyun; Jung, Daniel H; Kim, Jonghoon J; Choi, Sumin; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.5 - 9, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

7
Design of Contactless Wafer-level TSV Connectivity Testing Structure using Capacitive Coupling

Kim, Jounghoresearcher; Kim, Jonghoon J; Kim, Heegon; Kim, Sukjin; Bae, Bumhee; Jung, Daniel H; Kong, Sunkyu; Lee, Junho; Park, Kunwoo, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), pp.158 - 162, IEEE Electromagnetic Compatibility of Integrated Circuits(EMC Compo), 2013-12-15

8
An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, Jounghoresearcher, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06

9
30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Suk Jin; Kim, Jonghoon J.; Bae, Bumhee; Kim, Jonghoon; Yook, Jong-Min; Kim, Jun-Chul; Kim, Joung-Horesearcher, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816, 2014-11

10
Measurement and Analysis of a High-Speed TSV Channel

Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Myung-Hoi; Kim, Ki-Yeong; Lee, Jun-Ho; Lee, Hyung-Dong; Park, Kun-Woo; Choi, Kwang-Seong; Bae, Hyun-Cheol; Kim, Joung-Horesearcher; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.10, pp.1672 - 1685, 2012-10

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