횡방향 열초음파 본딩 기법을 이용한 COG 접합Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology

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In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding,observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.
Publisher
한국정밀공학회
Issue Date
2010-07
Language
Korean
Citation

한국정밀공학회지, v.27, no.7, pp.7 - 12

ISSN
1225-9071
URI
http://hdl.handle.net/10203/98794
Appears in Collection
ME-Journal Papers(저널논문)
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