Characteristics of the Deposition Rate per Unit Power on Pulsed-DC Magnetron Sputtering Source

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The deposition rate per unit power in a pulsed-DC magnetron sputtering source was examined according to the target material, average power, and duty cycle. In a short duty cycle condition, the deposition rate per unit power of Ti and Cu decreased with increasing the pulse power, while that of Al and Ti in a long duty cycle condition did not change in relation to the pulse power. These results can be explained in terms of the characteristics of the sputtering yield in relation to the bombarding ion energy. Based on these results, a pulse voltage with two steps is proposed in order to increase the deposition rate per unit power.
Publisher
WILEY-V C H VERLAG GMBH
Issue Date
2009-12
Language
English
Article Type
Article
Keywords

AR; IONS

Citation

PLASMA PROCESSES AND POLYMERS, v.6, no.12, pp.855 - 859

ISSN
1612-8850
DOI
10.1002/ppap.200900026
URI
http://hdl.handle.net/10203/96593
Appears in Collection
PH-Journal Papers(저널논문)
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