Air-stable silver-coated copper particles of sub-micrometer size

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dc.contributor.authorJung, Dae-Sooko
dc.contributor.authorLee, H. M.ko
dc.contributor.authorKang, Y. C.ko
dc.contributor.authorPark, Seung-Binko
dc.date.accessioned2013-03-09T12:20:24Z-
dc.date.available2013-03-09T12:20:24Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-12-
dc.identifier.citationJOURNAL OF COLLOID AND INTERFACE SCIENCE, v.364, no.2, pp.574 - 581-
dc.identifier.issn0021-9797-
dc.identifier.urihttp://hdl.handle.net/10203/96327-
dc.description.abstractSilver-coated copper particles with various silver loading were prepared by a direct liquid-to-particle conversion process in spray pyrolysis reactor system. The prepared particles were completely densified at 900 degrees C within a residence time of 2.1 s and had core-shell structure, of which formation mechanism was proposed. The mean diameter of particles was 0.45 mu m. Copper particles of 20 wt.% of silver loading were stable under air and 95% of copper remained as metallic copper even after 1 month of exposure to air. This enhanced air-stability contributed to the enhanced electrical property of conductive film obtained from the coated particles. The conductive film obtained from 15 wt.% of silver-coated copper particles had a sheet resistance of 1.2 m Omega square(-1). This low resistance resulted from the lack of oxide layer and low sintering temperature of silver layer. (C) 2011 Elsevier Inc. All rights reserved.-
dc.languageEnglish-
dc.publisherACADEMIC PRESS INC ELSEVIER SCIENCE-
dc.subjectSPRAY-PYROLYSIS-
dc.subjectTITANIA POWDERS-
dc.subjectNANOPARTICLES-
dc.subjectOXIDATION-
dc.subjectGENERATION-
dc.subjectSTABILITY-
dc.subjectIRON-
dc.titleAir-stable silver-coated copper particles of sub-micrometer size-
dc.typeArticle-
dc.identifier.wosid000296223500040-
dc.identifier.scopusid2-s2.0-80054693811-
dc.type.rimsART-
dc.citation.volume364-
dc.citation.issue2-
dc.citation.beginningpage574-
dc.citation.endingpage581-
dc.citation.publicationnameJOURNAL OF COLLOID AND INTERFACE SCIENCE-
dc.contributor.localauthorPark, Seung-Bin-
dc.contributor.nonIdAuthorLee, H. M.-
dc.contributor.nonIdAuthorKang, Y. C.-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorCopper particles-
dc.subject.keywordAuthorAir-stability-
dc.subject.keywordAuthorCoating-
dc.subject.keywordAuthorConductive film-
dc.subject.keywordAuthorSpray pyrolysis-
dc.subject.keywordPlusSPRAY-PYROLYSIS-
dc.subject.keywordPlusTITANIA POWDERS-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordPlusOXIDATION-
dc.subject.keywordPlusGENERATION-
dc.subject.keywordPlusSTABILITY-
dc.subject.keywordPlusIRON-
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