Formation of large scale via slug for high power LED package

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dc.contributor.authorPark, JKko
dc.contributor.authorHong, KPko
dc.contributor.authorPark, SYko
dc.contributor.authorChang, BGko
dc.contributor.authorJeong, SGko
dc.contributor.authorShin, Hyun Dongko
dc.date.accessioned2013-03-08T03:49:36Z-
dc.date.available2013-03-08T03:49:36Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-06-
dc.identifier.citationJOURNAL OF CERAMIC PROCESSING RESEARCH, v.9, no.3, pp.262 - 266-
dc.identifier.issn1229-9162-
dc.identifier.urihttp://hdl.handle.net/10203/92055-
dc.description.abstractA high power LED package based on a LTCC, a Multi Layer Ceramic-Metal Package, MLCMP, has been proposed. The MLCMP utilizes a large scale via slug for a heat sink slug whose cross sectional area is greater than an ordinary LED die size, which reaches up to 3 mm(2). The via slug along with ceramic body could be built simultaneously by one shot sintering with standard manufacturing process of a LTCC and no additional flattening process or post process was needed. On the other hand a large scale via slug of a MLCMP may result in undesirable defects such as de-lamination, cracking or cambering. However, those defects could be avoided by deliberately managing the fabrication process and sintering process. In particular, an inner surface coating with a low viscosity Ag paste was very effective for preventing the defects. As a result, we have succeeded in establishing a robust manufacturing process of a MLCMP that endures various reliability tests including a repetitive thermal shock test. Transient thermal analysis has revealed that the thermal resistance contributed to the MLCMP is less than 1.0 K/W. Considering the affordability and design flexibility, we anticipate the proposed MLCMP is not only suitable for high power LED packages but also a promising solution for illumination modules.-
dc.languageEnglish-
dc.publisherKOREAN ASSOC CRYSTAL GROWTH-
dc.titleFormation of large scale via slug for high power LED package-
dc.typeArticle-
dc.identifier.wosid000258006800011-
dc.identifier.scopusid2-s2.0-48749117806-
dc.type.rimsART-
dc.citation.volume9-
dc.citation.issue3-
dc.citation.beginningpage262-
dc.citation.endingpage266-
dc.citation.publicationnameJOURNAL OF CERAMIC PROCESSING RESEARCH-
dc.contributor.localauthorShin, Hyun Dong-
dc.contributor.nonIdAuthorPark, JK-
dc.contributor.nonIdAuthorHong, KP-
dc.contributor.nonIdAuthorPark, SY-
dc.contributor.nonIdAuthorChang, BG-
dc.contributor.nonIdAuthorJeong, SG-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorLTCC-
dc.subject.keywordAuthorthermal via-
dc.subject.keywordAuthorLED-
dc.subject.keywordAuthorpackage-
dc.subject.keywordAuthorthermal resistance-
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