DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, JK | ko |
dc.contributor.author | Hong, KP | ko |
dc.contributor.author | Park, SY | ko |
dc.contributor.author | Chang, BG | ko |
dc.contributor.author | Jeong, SG | ko |
dc.contributor.author | Shin, Hyun Dong | ko |
dc.date.accessioned | 2013-03-08T03:49:36Z | - |
dc.date.available | 2013-03-08T03:49:36Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-06 | - |
dc.identifier.citation | JOURNAL OF CERAMIC PROCESSING RESEARCH, v.9, no.3, pp.262 - 266 | - |
dc.identifier.issn | 1229-9162 | - |
dc.identifier.uri | http://hdl.handle.net/10203/92055 | - |
dc.description.abstract | A high power LED package based on a LTCC, a Multi Layer Ceramic-Metal Package, MLCMP, has been proposed. The MLCMP utilizes a large scale via slug for a heat sink slug whose cross sectional area is greater than an ordinary LED die size, which reaches up to 3 mm(2). The via slug along with ceramic body could be built simultaneously by one shot sintering with standard manufacturing process of a LTCC and no additional flattening process or post process was needed. On the other hand a large scale via slug of a MLCMP may result in undesirable defects such as de-lamination, cracking or cambering. However, those defects could be avoided by deliberately managing the fabrication process and sintering process. In particular, an inner surface coating with a low viscosity Ag paste was very effective for preventing the defects. As a result, we have succeeded in establishing a robust manufacturing process of a MLCMP that endures various reliability tests including a repetitive thermal shock test. Transient thermal analysis has revealed that the thermal resistance contributed to the MLCMP is less than 1.0 K/W. Considering the affordability and design flexibility, we anticipate the proposed MLCMP is not only suitable for high power LED packages but also a promising solution for illumination modules. | - |
dc.language | English | - |
dc.publisher | KOREAN ASSOC CRYSTAL GROWTH | - |
dc.title | Formation of large scale via slug for high power LED package | - |
dc.type | Article | - |
dc.identifier.wosid | 000258006800011 | - |
dc.identifier.scopusid | 2-s2.0-48749117806 | - |
dc.type.rims | ART | - |
dc.citation.volume | 9 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 262 | - |
dc.citation.endingpage | 266 | - |
dc.citation.publicationname | JOURNAL OF CERAMIC PROCESSING RESEARCH | - |
dc.contributor.localauthor | Shin, Hyun Dong | - |
dc.contributor.nonIdAuthor | Park, JK | - |
dc.contributor.nonIdAuthor | Hong, KP | - |
dc.contributor.nonIdAuthor | Park, SY | - |
dc.contributor.nonIdAuthor | Chang, BG | - |
dc.contributor.nonIdAuthor | Jeong, SG | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | LTCC | - |
dc.subject.keywordAuthor | thermal via | - |
dc.subject.keywordAuthor | LED | - |
dc.subject.keywordAuthor | package | - |
dc.subject.keywordAuthor | thermal resistance | - |
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