Formation of large scale via slug for high power LED package

Cited 3 time in webofscience Cited 0 time in scopus
  • Hit : 526
  • Download : 0
A high power LED package based on a LTCC, a Multi Layer Ceramic-Metal Package, MLCMP, has been proposed. The MLCMP utilizes a large scale via slug for a heat sink slug whose cross sectional area is greater than an ordinary LED die size, which reaches up to 3 mm(2). The via slug along with ceramic body could be built simultaneously by one shot sintering with standard manufacturing process of a LTCC and no additional flattening process or post process was needed. On the other hand a large scale via slug of a MLCMP may result in undesirable defects such as de-lamination, cracking or cambering. However, those defects could be avoided by deliberately managing the fabrication process and sintering process. In particular, an inner surface coating with a low viscosity Ag paste was very effective for preventing the defects. As a result, we have succeeded in establishing a robust manufacturing process of a MLCMP that endures various reliability tests including a repetitive thermal shock test. Transient thermal analysis has revealed that the thermal resistance contributed to the MLCMP is less than 1.0 K/W. Considering the affordability and design flexibility, we anticipate the proposed MLCMP is not only suitable for high power LED packages but also a promising solution for illumination modules.
Publisher
KOREAN ASSOC CRYSTAL GROWTH
Issue Date
2008-06
Language
English
Article Type
Article
Citation

JOURNAL OF CERAMIC PROCESSING RESEARCH, v.9, no.3, pp.262 - 266

ISSN
1229-9162
URI
http://hdl.handle.net/10203/92055
Appears in Collection
ME-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 3 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0