DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hwang, SH | ko |
dc.contributor.author | Cho, MH | ko |
dc.contributor.author | Kang, SK | ko |
dc.contributor.author | Lee, TW | ko |
dc.contributor.author | Park, HyoHoon | ko |
dc.contributor.author | Rho, BU | ko |
dc.date.accessioned | 2013-03-08T01:18:49Z | - |
dc.date.available | 2013-03-08T01:18:49Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-03 | - |
dc.identifier.citation | IEEE PHOTONICS TECHNOLOGY LETTERS, v.19, no.5-8, pp.411 - 413 | - |
dc.identifier.issn | 1041-1135 | - |
dc.identifier.uri | http://hdl.handle.net/10203/91707 | - |
dc.description.abstract | The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers x 4 channels x 4 parallel links x 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90 degrees-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | Two-dimensional optical interconnection based on two-layered optical printed circuit board | - |
dc.type | Article | - |
dc.identifier.wosid | 000245768200052 | - |
dc.identifier.scopusid | 2-s2.0-35348891765 | - |
dc.type.rims | ART | - |
dc.citation.volume | 19 | - |
dc.citation.issue | 5-8 | - |
dc.citation.beginningpage | 411 | - |
dc.citation.endingpage | 413 | - |
dc.citation.publicationname | IEEE PHOTONICS TECHNOLOGY LETTERS | - |
dc.identifier.doi | 10.1109/LPT.2007.892888 | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.nonIdAuthor | Hwang, SH | - |
dc.contributor.nonIdAuthor | Cho, MH | - |
dc.contributor.nonIdAuthor | Kang, SK | - |
dc.contributor.nonIdAuthor | Lee, TW | - |
dc.contributor.nonIdAuthor | Rho, BU | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | 90 degrees-bent fiber block | - |
dc.subject.keywordAuthor | chip-to-chip optical interconnection | - |
dc.subject.keywordAuthor | optical modules | - |
dc.subject.keywordAuthor | optical printed circuit board (OPCB) | - |
dc.subject.keywordAuthor | passive assembly | - |
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