Microseale metal patterning using photosensitive silver organometallic compounds

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We report a simple method for realizing the direct lithographic patterning of metallic silver and its alloy from amorphous films of photosensitive silver organometallic compounds. In this process, ultraviolet (UV) light was used to selectively activate organometallic compounds, converting organometallic compounds to metallic states in illuminated regions. The photolysis process was monitored by FTIR spectroscopy and the products were analyzed by UV-visible light spectrometry, X-ray photoelectron spectroscopy (XPS), and X-ray diffraction analysis (XRD). A feature size of 5 mu m was demonstrated through the process.
Publisher
JAPAN SOC APPLIED PHYSICS
Issue Date
2005-02
Language
English
Article Type
Article
Keywords

THIN-FILMS; TITANIUM-NITRIDE; AG FILMS; ENCAPSULATION; LITHOGRAPHY; ADHESION; AMBIENT; COPPER

Citation

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS REVIEW PAPERS, v.44, no.2, pp.865 - 868

ISSN
0021-4922
DOI
10.1143/JJAP.44.865
URI
http://hdl.handle.net/10203/90965
Appears in Collection
CH-Journal Papers(저널논문)
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