DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sohn, IB | ko |
dc.contributor.author | Lee, Man Seop | ko |
dc.contributor.author | Chung, JY | ko |
dc.date.accessioned | 2013-03-07T18:21:34Z | - |
dc.date.available | 2013-03-07T18:21:34Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-11 | - |
dc.identifier.citation | IEEE PHOTONICS TECHNOLOGY LETTERS, v.17, pp.2349 - 2351 | - |
dc.identifier.issn | 1041-1135 | - |
dc.identifier.uri | http://hdl.handle.net/10203/90914 | - |
dc.description.abstract | A novel packaging process using a femtosecond laser has been developed for passive alignment of planar lightwave circuit devices. With only one step of micromachining, optical splitter and U-grooves for fiber aligning are simultaneously defined on fused silica glass. The fiber aligned optical splitter has a low insertion loss, less than 4 dB, including an intrinsic splitting loss of 3 dB and excess loss due to the passive alignment of a single-mode fiber. Finally, the output field pattern is presented, demonstrating the splitting ratio of the optical splitter is approximately 1: 1. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | PLC PLATFORM | - |
dc.subject | PULSES | - |
dc.title | Fabrication of optical splitter and passive alignment technique with a femtosecond laser | - |
dc.type | Article | - |
dc.identifier.wosid | 000232898100036 | - |
dc.identifier.scopusid | 2-s2.0-27744588657 | - |
dc.type.rims | ART | - |
dc.citation.volume | 17 | - |
dc.citation.beginningpage | 2349 | - |
dc.citation.endingpage | 2351 | - |
dc.citation.publicationname | IEEE PHOTONICS TECHNOLOGY LETTERS | - |
dc.identifier.doi | 10.1109/LPT.2005.858101 | - |
dc.contributor.localauthor | Lee, Man Seop | - |
dc.contributor.nonIdAuthor | Sohn, IB | - |
dc.contributor.nonIdAuthor | Chung, JY | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | femtosecond (fs) laser | - |
dc.subject.keywordAuthor | laser materials-processing | - |
dc.subject.keywordAuthor | applications | - |
dc.subject.keywordAuthor | optical device fabrication | - |
dc.subject.keywordAuthor | optical planar waveguide | - |
dc.subject.keywordAuthor | packaging | - |
dc.subject.keywordAuthor | passive alignment | - |
dc.subject.keywordPlus | PLC PLATFORM | - |
dc.subject.keywordPlus | PULSES | - |
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