Effects of reactive diffusion on stress evolution in Cu-Sn films

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During isothermal aging of Cu-Sn films, in situ stress measurements showed tensile stress evolutions in the early stage and compressive stresses finally. The tensile force resulted from the volume shrinkage by reactive interdiffusion, while the compressive stress resulted from the volume expansion by the dominant diffusion of Cu into Sn. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Issue Date
2004-07
Language
English
Article Type
Article
Keywords

EUTECTIC SNPB; TIN WHISKERS; THIN-FILMS; KINETICS; MORPHOLOGY; SOLDERS; GROWTH

Citation

SCRIPTA MATERIALIA, v.51, no.2, pp.167 - 170

ISSN
1359-6462
DOI
10.1016/j.scriptamat.2004.03.032
URI
http://hdl.handle.net/10203/79664
Appears in Collection
MS-Journal Papers(저널논문)
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