Precision forging design and analysis in electronics part manufacturing

Abstract

In order to increase the productivity of electrical parts, manufacturing processes using progressive dies have been widely used in the industry. With a progressive die, however, closed die forging is impossible because the part has to be connected with a strip layout so that there might arise various problems in the die design. For the proper design of a process, a prediction of the process is required to obtain relevant design parameters. In this work, three-dimensional rigid-plastic finite element analysis is carried out to simulate a precision forging process. The forging process of the stem, a part of a photo pickup hologram device, is simulated with two types of processes-open die forging and semiclosed die forging. From the results of analyses, the forging processes can be predicted successfully, which enables the die and the process to be designed appropriately.