다결정 실리콘 패드를 이용한 평면형 안티퓨즈의 소자특성 및 금속도선 형성에 관한 연구Device Characteristics and Metal Link Formation in the Planar Antifuse with Poly-Si Pad
- Publisher
- 대한전자공학회
- Issue Date
- 1996-12
- Language
- Korean
- Citation
전자공학회논문지 A, v.33, no.8, pp.158 - 166
- ISSN
- 1016-135X
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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