Browse "College of Engineering(공과대학)" by Type Conference
Showing results 73621 to 73640 of 90910
| VUV and EUV spectroscopic diagnostics in KSTAR and their application to Kr injection experiments Shin, Haewon; Choe, Wonho, 9th Japan- Korea Seminar on Advanced Diagnostics for Steady-State Fusion Plasmas, National Institute for Fusion Science, 2018-08-07 |
| VVQ: Virtualizing Virtual Channel for Cost-Efficient Protocol Deadlock Avoidance Kasan, Hans; Kim, John Dongjun, 29th Annual IEEE International Symposium on High Performance Computer Architecture, HPCA 2023, pp.1072 - 1084, IEEE Computer Society, 2023-02-28 |
| V계 BCC 수소저장합금의 수소저장 특성에 미치는 Mn첨가의 효과 이재영, 춘계 한국수소에너지 학회, 2001 |
| W-CDMA 시스템에서 CPCH 액세스 방식의 성능 분석 소재우; 조동호, 한국통신학회 추계종합학술 발표회, pp.379 - 382, 한국통신학회, 2000-11 |
| W-CDMA 터보디코딩을 위한 효율적인 Stopping Criteria 이동수; 박인철, 대한전자공학회 추계학술대회, pp.265 - 268, 대한전자공학회, 2003-11 |
| W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis Kim, Eomji; Cho, Eun Ae, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01 |
| W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동 강병철; 류호진; 홍순형, 추계분말야금학회, 분말야금학회, 2015-11-05 |
| W-밴드데역에서의 칩투칩통신을 위한 고이득 및 광대역 비발디 안테나 JANG, TAEHWAN; Kim, Hong-Yi; Oh, Inn-Yeal; Park, Chul Soon, 2014년 한국ITS학회 추계학술대회, 한국ITS학회, 2014-10-31 |
| W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계 백승헌; 조순하; 조영훈; 박병국, 2015 동계학술대회, 한국 자기학회, 2015-11-27 |
| W2F2Q : 무선 패킷 네트워크에서 공평 큐잉 이융; 석용호; 최양희; 한동원, 한국통신학회 하계학술대회, 2000 |
| W2F2Q: Packet Fair Queuing inWireless Packet Networks Yi, Yung; Seok, Yongho; Kwon, Taekyoung; Choi, Yanghee; Park, Junseok, The 3rd ACM International Workshop on Wireless Mobile Multimedia, WoWMoM 2000, pp.2 - 10, ACM, 2000-08-11 |
| WADN: Web Application Delivery Network Kim, Jungsook; Jo, SungJae; Song, Junehwa; Lim, Minyeol; Park, Hyungwoo, International Conference on Ubiquitous Computing(ICUC), pp.0 - 0, ICUC, 2003-10-01 |
| Wafer admission control for clustered photolithography tools Park, Kyung Soo; Morrison J.R., 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010, pp.220 - 225, 2010-07-11 |
| Wafer admission control for clustered photolithography tools Park, Kyungsu; Morrison, James R, Advanced Semiconductor Manufacturing Conference , pp.220 - 225, ASMC, 2010-07 |
| Wafer Coating Process of Cu-based Methanol Steam Reforming Catalysts for Wafer Based MEMS Catalytic Reactor Kim, Taegyu; Lee, Dae Hoon; Yoon, Chun Ho; Kwon, Sejin, The 6th International Symposium on Nanocomposites & Nanoporous Materials, 2005-02 |
| Wafer level ACA packages and their applications to advanced electronic packaging Paik, Kyung-Wook; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 123, 2008-12-09 |
| Wafer Level Fabrication of Plasmonic Nanopores using Solid-state Diffusion Hwang, Charles Soon Hong; Lee, Young Seop; Jeong, Ki Hun, 한국광학회 2016년도 하계학술대회, (사)한국광학회, 2016-07-11 |
| Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
| Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27 |
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