Browse "College of Engineering(공과대학)" by Type Conference

Showing results 69841 to 69860 of 90910

69841
Thermally stable and low-loss optical waveguide using optical-fiber- embedded epoxy matrix for optical printed-circuit board applications

Im, DM; Kim, JH; Cho, MH; Kim, DW; Kim, SJ; Choi, JB; Park, HyoHoon, Optoelectronic Interconnects and Component Integration IX, Optoelectronic Interconnects and Component Integration IX, 2010-01-25

69842
Thermally stable double-layered amorphous-SnO2/AZO transparent conducting oxide for dye-sensitized solar cells

이희상; 우성일, 한국화학공학회 2014년도 가을총회 및 학술대회, 한국화학공학회 (KIChE), 2014-10

69843
Thermally stable lithium niobate integrated-optic voltage sensor with variable sensing ranges

Yim, YS; Shin, Sang Yung, 13th International Conference on Optical Fiber Sensors, pp.232, 13th International Conference on Optical Fiber Sensors, 1999-04

69844
Thermally Stable Photo-Curable Cyclo-aliphatic Epoxy hybrid Material for White LED Encapsulant

배병수; SeungCheol Yang; Seung-Yeon Kwak; Joon-Soo Kim, 2011년도 추계 고분자학회, 한국고분자학회, 2011-10

69845
Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printedcircuit board

Kim, DW; Ahn, SH; Cho, IK; Im, DM; Shorab Muslim, SM; Park, HyoHoon, 11th International Conference on Advanced Communication Technology, ICACT 2009, v.2, pp.1430 - 1432, ICACT, 2009-02-15

69846
Thermally stable Sol-Gel derived siloxane hydrid material for light emitting diode (LED) encapsulation

Bae, Byeong-Soo; Bae, Junyoung; Kim, Yongho; Kim, Hwea-yoon, 2013 International Sol-Gel Conference, ISGS, 2013-08

69847
Thermally Stable Thin Film-based Disposable Cartridge for Plasmonic RPA and Cas12a

유은실; 강병훈; 정혜정; 권재명; 나하민; 정기훈, 2023년 한국바이오칩학회 춘계학술대회, (사)한국바이오칩학회, 2023-05-31

69848
Thermally stable transparent sol-gel siloxane hybrid materials for LED encapsulants

Bae, Byeong-Soo; Kim, J; Yang, S, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

69849
Thermally Stable Vertical μLED Patch for Facilitating Hair Growth

LEE, JAEHEE; Lee, Keon Jae, 2022 MRS SPRING MEETING & EXHIBIT, Materials Research Society, 2022-05-11

69850
Thermally Stable Vertical μLED Patch for Facilitating Hair Growth by Light Stimulation

Lee, JaeHee; Lee, Keon Jae, The 22nd International Meeting on Information Display (IMID 2022), The Korean Information Display Society, 2022-08-26

69851
Thermally stable ZnF2/Al-doped ZnO double-layered transparent conducting oxide for dye-sensitized and perovskite solid state solar cells

이희상; 김수호; 우성일, 2015 KIChE Spring Meeting, KIChe, 2015-04

69852
Thermally Switchable One- and Two-Dimensional Arrays of SWNTs in a Polymeric System

Choi SungMin; Doe, Changwoo; Jang, Hyung-Sik; Kim, Tae-Hwan; Kline, Steven R., ChemOnTubes 2010, 2010-04

69853
Thermally Tunable Free-Standing Photonic Crystals Through Assembly of Soft Colloids

Park, Jin-Gyu; Rogers, W. Benjamin; Magkiriadou, Sofia; Kodger, Tom; Kim, Shin-Hyun; Kim, Young-Seok; Manoharan, Vinothan N., 2014 MRS Spring Meeting , Materials Research Society, 2014-04-22

69854
Thermally tunable microlenses using smetic liquid crystal defects

김정현; 정현수; 손백식; 정희태, 대한화학회 제107회 총회 및 학술발표회, 대한화학회, 2011-04-29

69855
Thermally-driven convection of a compressible fluid in a rapidly rotating cylinder

Hyun, Jae Min; Park, J.K., Hemisphere Publ. Corp., pp.365 - 374, 1989

69856
Thermally-Responsive Softening Intravenous Needle for Enhancement of Patient Care and Healthcare Provider Safety

Agno, Karen-Christian; Yang, Keungmo; Byun, Sanghyuk; OH, SUBIN; Lee, Simok; Kim, Heesoo; Kim, kyurae; et al, 2023 MRS Spring Meeting & Exhibit, Materials Research Society, 2023-04-14

69857
Thermo- and photo-responsive polymersomes

Amstad, Esther; Kim, Shin-Hyun; Weitz, David A., 2013 MRS fall meeting, Materials Research Society, 2013-12-02

69858
Thermo-acoustic Instability in a Combustor with Branch Tube

Park, Jang Hee; Guahk, Young Tae; Shin, Hyun Dong, , JSME-KSME, 2008

69859
Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산

박상희; 박중근, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000

69860
Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection

Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01

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