Browse "College of Engineering(공과대학)" by Type Conference
Showing results 69661 to 69680 of 90872
| Thermal and Mechanical Properties of Epoxy-Graphene Composites by Using Non-covalent Functionalization Jeon, Seokwoo; Sungho, Song, RPRG, Institute of Physics (IOP), Chinese Academy of Sciences (CAS), Beijing National Laboratory for Condensed Matter Physics (BNLCP), 2012-11-06 |
| Thermal and Mechanical Properties of W/Cu Nanocomposite for Heat Sink Application Hong, Soon-Hyung, pp.0 - 0, 2002-06-01 |
| Thermal and Mechanical Stability Analysis of the Transmission Target of a CNT-Based Microfocus X-ray Tube Cho, Sung Oh; IHSAN, Aamir; HEO, Sung Hwan, 한국물리학회 (2006년 가을 논문발표회), pp.527 - 528, 한국물리학회, 2006 |
| Thermal and mechnical properties of PEN/PBN blends Yoon, KH; Lee. SC; Park, OOk, 1994 Spring Meeting of the Polymer Society of Korea in Seoul, Polymer Society of Korea, 1994 |
| Thermal annealing chracteristics of amorphous silicon-based solar cells incorporating stable protocrystalline silicon and unstable microcrystalline silicon at the onset of a microcrystalline regime Ahn, J.Y.; Jun, K.H.; Konagai, M.; Lim, Koeng Su, Proceddings of the 3rd World Conference on Photovoltaic Energy Conversion, pp.1741 - 1744, 2003-05-11 |
| Thermal Annealing 효과에 의한 다층박막 FBAR 소자의 공진특성개선 윤기완; 김동현; 임문혁; Linh, Mai, 한국해양정보통신학회추계학술대회, pp.633 - 636, 한국해양정보통신학회, 2003-10 |
| Thermal Aspects of Micro-Mechanical Engineering Kim, SungJin, Internal Symposium on Micro-Mechanical Engineering, pp.115 - 124, 2003 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
| Thermal Behavior Analysis of TDLAS Sensor under Wall Heat Flux of Scramjet Intake Kim, Gyeongrok; Shim, HanSeul; Jung, Sion; Min, Tae-Hong; PARK, GISU, The 34th International Symposium on Shock Waves, National Symposium on Shock Waves Korea, 2023-07-18 |
| Thermal Behavior of Boronsilicate Molecular Sieve Woo, Seong-Ihl; Hong, SB; Lee, JK; Uh, YS, Korea Chemical Society Fall Symposium, Korea Chemical Society, 1987 |
| Thermal behavior of crosslinked gelatin with poly(N-isopropylacrylamide) grafts Kang, HS; Kim, BY; Kim, Jong-Duk, The 10th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.0 - 0, 1997-11-01 |
| Thermal behavior of Sn nanowires for nano-interconnection Shin, H; Song, J; Yu, Jin, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| Thermal buckling analysis of composite cylindrical panels with embedded SMA wires Lee, H.J.; Lee, Jungju, KSCM Annual Autumn Conference, pp.169 - 173, 1997-11 |
| Thermal buckling and acoustic vibration characteristics of the shape memory alloy hybrid composite plate Lee, In; Kim, Eun-Ho; Rim, Mi-Sun, 18th International Congress on Sound and Vibration, International Congress on Sound and Vibration, 2011-07-11 |
| Thermal buckling and deformation of aerospace structures and their improvement with shape memory alloys Lee, In; Kim, E.-H; Roh, J.-H, 8th International Congress on Thermal Stresses, pp.65 - 65, 2009-06-02 |
| Thermal buckling and postbuckling analysis of a laminated composite beam with embedded SMA actuators Lee, Jungju; Choi S., 10th International Conference on Composite Structures, v.47, no.40547, pp.695 - 703, 1999-11-15 |
| Thermal buckling of composite beam with embedded shape memory alloy actuators Lee, Jungju, Proceeding of ICCM, pp.0 - 0, ICCM, 1999-07-05 |
| Thermal Characterics of Long-Period Grating in Silicon Optical Waveguide Cho, YB; Yang, BK; Shin, Sang Yung, Asia-Pacific Optical Communications, 2006 |
| Thermal characteristics of long-period gratings in silicon optical waveguide Cho, Y.B.; Yang, B.K.; Shin, Sang Yung, Passive Components and Fiber-based Devices III, v.6351 I, 2006-09-05 |
| Thermal characteristics of pulsating heat pipes operating in a circulation mode Noh, Hyung Yoon; Kim, Sung-Jin, International Mechanical Engineering Congress & Exposition, ASME, 2016-11-13 |
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