Browse "College of Engineering(공과대학)" byTypeConference

Showing results 59601 to 59620 of 83382

Studies on Burnup Credit Criticality Safety for Storage and Transportation of PWR Spent Fuel in Korea

Koh, D.J; Cho, Nam-Zinresearcher, The Sixth International Conference on Nuclear Criticality Safety (ICNT'99), v.3, pp.1934 -, 1999-09

Studies on Carbon Dioxide Separation through Membrane Absorber

고준성; 홍정진; 양승만researcher, The 9th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.295 - 296, 1996-10-01

Studies on Cd0.96Zn0.04Te/Hg0.78Cd0.22Te MIS structures

Lee, Hee Chulresearcher, ACSSI-2002, pp.0 - 0, 2002-11-01

Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Taihua, L; Park, Hyun Gyuresearcher, Annual Meeting of Korean Institute of Biotechnology and Bioengineering, 2003

Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Park, Hyun Gyuresearcher, Conference on Nanoscale Devices and System Integration(NDSI)--IEEE/NANO-2004, pp.0 - 0, 2004

Studies on cyclic behaviors of the unit bucket for tripod foundation system under various loadings via centrifuge model tests

Jeong, Yeong Hoon; Kim, Dong-Sooresearcher; Kim, Jae Hyun; Parkn Hun Jun, Geo-Congress 2019, ASCE, 2019-03-25

Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

Studies on growth of monodispersed silica particles by sol-gel method

양승만researcher, 한국화학공학회 춘계학술발표회, pp.953 - 956, 한국화학공학회, 1998-04-01

Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers

강상원researcher, 제2회 한국진공학회 학술발표회, 1992

Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability

전영두; 백경욱researcher, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01

Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wookresearcher; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29

Studies on Preparation of Monodispersed Silica Particles using Sol-Gel Method and Rheological Behaviors of Silica Dispersion

양승만researcher, 한국화학공학회 춘계학술발표회, pp.905 - 908, 한국화학공학회, 1996-04-01

Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes

Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003

Studies on the application of supercritical carbon dioxide cycle to a small modular reactor

Yoon,HJ; Ahn,Y; Lee,JH; Lee, JeongIkresearcher, International Congress on Advances in Nuclear Power Plants 2011 (ICAPP 2011), French Nuclear Energy Society, 2011-05

Studies on the Biodegradation of Polyurethanes under Compositing Conditions.

Kim, Sung Chulresearcher, Pacific Polymer Conference, 1997

Studies on the dimensional and piezoelectric characteristics of 3D printed piezoelectric structures

KIM, InSup; Yoon, Yong Jinresearcher, International Symposium on Precision Engineering and Sustainable Manufacturing, PRESM 2021, 한국정밀공학회, 2021-07-21

Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications

Paik, Kyung-Wookresearcher; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01

Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wookresearcher, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers

Sang-Won Kangresearcher, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991

Studies on the modification of Epoxy resin with polydimethylsiloxane

Kim, Sung Chulresearcher, 36th IUPAC international symposium on macromolecules, 1996



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