Browse "College of Engineering(공과대학)" byTypeConference

Showing results 59601 to 59620 of 83382

59601
Studies on Burnup Credit Criticality Safety for Storage and Transportation of PWR Spent Fuel in Korea

Koh, D.J; Cho, Nam-Zinresearcher, The Sixth International Conference on Nuclear Criticality Safety (ICNT'99), v.3, pp.1934 -, 1999-09

59602
Studies on Carbon Dioxide Separation through Membrane Absorber

고준성; 홍정진; 양승만researcher, The 9th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.295 - 296, 1996-10-01

59603
Studies on Cd0.96Zn0.04Te/Hg0.78Cd0.22Te MIS structures

Lee, Hee Chulresearcher, ACSSI-2002, pp.0 - 0, 2002-11-01

59604
Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Taihua, L; Park, Hyun Gyuresearcher, Annual Meeting of Korean Institute of Biotechnology and Bioengineering, 2003

59605
Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Park, Hyun Gyuresearcher, Conference on Nanoscale Devices and System Integration(NDSI)--IEEE/NANO-2004, pp.0 - 0, 2004

59606
Studies on cyclic behaviors of the unit bucket for tripod foundation system under various loadings via centrifuge model tests

Jeong, Yeong Hoon; Kim, Dong-Sooresearcher; Kim, Jae Hyun; Parkn Hun Jun, Geo-Congress 2019, ASCE, 2019-03-25

59607
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

59608
Studies on growth of monodispersed silica particles by sol-gel method

양승만researcher, 한국화학공학회 춘계학술발표회, pp.953 - 956, 한국화학공학회, 1998-04-01

59609
Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers

강상원researcher, 제2회 한국진공학회 학술발표회, 1992

59610
Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability

전영두; 백경욱researcher, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01

59611
Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wookresearcher; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29

59612
Studies on Preparation of Monodispersed Silica Particles using Sol-Gel Method and Rheological Behaviors of Silica Dispersion

양승만researcher, 한국화학공학회 춘계학술발표회, pp.905 - 908, 한국화학공학회, 1996-04-01

59613
Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes

Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003

59614
Studies on the application of supercritical carbon dioxide cycle to a small modular reactor

Yoon,HJ; Ahn,Y; Lee,JH; Lee, JeongIkresearcher, International Congress on Advances in Nuclear Power Plants 2011 (ICAPP 2011), French Nuclear Energy Society, 2011-05

59615
Studies on the Biodegradation of Polyurethanes under Compositing Conditions.

Kim, Sung Chulresearcher, Pacific Polymer Conference, 1997

59616
Studies on the dimensional and piezoelectric characteristics of 3D printed piezoelectric structures

KIM, InSup; Yoon, Yong Jinresearcher, International Symposium on Precision Engineering and Sustainable Manufacturing, PRESM 2021, 한국정밀공학회, 2021-07-21

59617
Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications

Paik, Kyung-Wookresearcher; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01

59618
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wookresearcher, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

59619
Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers

Sang-Won Kangresearcher, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991

59620
Studies on the modification of Epoxy resin with polydimethylsiloxane

Kim, Sung Chulresearcher, 36th IUPAC international symposium on macromolecules, 1996

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