Showing results 45801 to 45820 of 90872
Microwave Absorption Characteristics of Honeycomb with Resistive Coating Choi, Jae-Hun; Nam, Young-Woo; Jang, Min-Su; Kim, Chun-Gon, The 29th International Conference on Adaptive Structures and Technologies, Konkuk University, 2018-10-03 |
Microwave absorption in warm, Maxwellian Plasma Bawaaneh, M.S.; Al-Khateeb, A.M.; Ghim, Young-chul, 5th Advanced Electromagnetics Symposium, Advanced Electromagnetics Symposium, 2017-07-27 |
Microwave Absorption Response of FSS Impinged Bi-layered Composite Absorber for Antiradar Applications Panwar, R; Hyun, JM; Lee, Jung Ryul, ASHMCS 2016, EI-K, 2016-08 |
Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 |
Microwave dielectric properties of epitaxial BaTiO3 film Choi, Si-Kyung; Cho, YW; Hyun, TS, The 16th international Symposium on Integrated Ferroelectrics, 2004 |
Microwave dielectric properties of ferroelectric BaTiO3 thin film Choi, Si-Kyung; Cho, YW; Hyun, TS, KAIST-Kyoto University Joint Symposium on Materials Science and Engineering for the 21st Century, pp.96 -, 2003 |
Microwave dielectric properties of ferroelectric BaTiO3 thin film Choi, Si-Kyung; Cho, YW, International Conference on Electroceramics, MIT, USA, pp.211 -, 2003 |
Microwave Engineering Education at KAIST Ra, Jung Woong, Asia-Pacific Microwave Technology and Educatuon Workshop, 1991 |
Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
Microwave frequency model of water level package and increased loading effect on rambus memory module Lee, J.; Choi, B.; Ahn, S.; Ryu, W.; Kim, J.M.; Choi, K.S.; Hong, J.-K.; et al, 51st Electronic Components and Technology Conference, pp.128 - 132, 2001-05-29 |
Microwave Graphene Syntheses and Graphene-based Artificial Muscles Jeon, Jin-Han; Sridhar, V; Oh, Il-Kwon, 6th World congress on Biomimetics, Articial Muscles and Nano-Bio, Université de Cergy-Pontoise, Université Paris Diderot, 2011-10 |
Microwave Imaging by Using a New Hybrid Algorithm Combined by Simulated Annealing and Gradient Algorithms Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.395 - 398, 1995 |
Microwave Imaging of a Perfectly Conducting Cylinder by Using the Angular Spectrum of the Scattered Fields Ra, Jung Woong, Asia-Pacific Microwave Conference, pp.1205 - 1208, 1994 |
Microwave Measurement of the Dielectric Constant of BST Films Lee, Hee Chul, pp.0 - 0, 1996-04-01 |
Microwave Model of Anisotropic Conductive Adhesive Flip-Chip Interconnections for High Frequency Applications Kim, Joungho; Paik, Kyung-Wook; Yim, M; Ryu, W; Jeon, Y, Electronic Components and Technology Conference, Electronic Components and Technology Conference, 1999-05 |
Microwave Modeling and Characterization of Anisotropic conductive Adhesive Flip-Chip Interconnection 김정호; 백경욱, 제6회 한국반도체 학술대회, pp.621 - 622, 한국반도체 학술대회, 1999-02 |
Microwave plasma 가열에 의한 비정질 실리콘 박막의 저온 결정화 이재영, 대한금속학회 추계학술대회, 1998 |
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