Browse "College of Engineering(공과대학)" byTypeConference

Showing results 65548 to 65567 of 81323

W-CDMA 시스템에서 CPCH 액세스 방식의 성능 분석

소재우; 조동호researcher, 한국통신학회 추계종합학술 발표회, pp.379 - 382, 한국통신학회, 2000-11

W-CDMA 터보디코딩을 위한 효율적인 Stopping Criteria

이동수; 박인철researcher, 대한전자공학회 추계학술대회, pp.265 - 268, 대한전자공학회, 2003-11

W-doped TiO2 as a support for the OER catalyst in polymer electrolyte membrane water electrolysis

Kim, Eomji; Cho, Eun Aeresearcher, 2016년도 연료전지 심포지엄, 한국전기화학회, 2016-09-01

W-Nb-Ti-V-Mo 고엔트로피 합금의 기계적 합금화 거동

강병철; 류호진researcher; 홍순형researcher, 추계분말야금학회, 분말야금학회, 2015-11-05

W-밴드데역에서의 칩투칩통신을 위한 고이득 및 광대역 비발디 안테나

JANG, TAEHWAN; Kim, Hong-Yi; Oh, Inn-Yeal; Park, Chul Soonresearcher, 2014년 한국ITS학회 추계학술대회, 한국ITS학회, 2014-10-31

W/CoFeB/MgO 구조에서 스핀-오빗 토크와 스핀 홀 자기저항의 상관관계

백승헌; 조순하; 조영훈; 박병국researcher, 2015 동계학술대회, 한국 자기학회, 2015-11-27

W2F2Q : 무선 패킷 네트워크에서 공평 큐잉

이융researcher; 석용호; 최양희; 한동원, 한국통신학회 하계학술대회, 2000

W2F2Q: Packet Fair Queuing inWireless Packet Networks

Yi, Yungresearcher; Seok, Yongho; Kwon, Taekyoung; Choi, Yanghee; Park, Junseok, The 3rd ACM International Workshop on Wireless Mobile Multimedia, WoWMoM 2000, pp.2 - 10, ACM, 2000-08-11

WADN: Web Application Delivery Network

Kim, Jungsook; Jo, SungJae; Song, Junehwaresearcher; Lim, Minyeol; Park, Hyungwoo, International Conference on Ubiquitous Computing(ICUC), pp.0 - 0, ICUC, 2003-10-01

Wafer admission control for clustered photolithography tools

Park, Kyungsu; Morrison, James Rresearcher, Advanced Semiconductor Manufacturing Conference , pp.220 - 225, ASMC, 2010-07

Wafer admission control for clustered photolithography tools

Park, Kyung Sooresearcher; Morrison J.R., 2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2010, pp.220 - 225, 2010-07-11

Wafer Coating Process of Cu-based Methanol Steam Reforming Catalysts for Wafer Based MEMS Catalytic Reactor

Kim, Taegyu; Lee, Dae Hoon; Yoon, Chun Ho; Kwon, Sejinresearcher, The 6th International Symposium on Nanocomposites & Nanoporous Materials, 2005-02

Wafer level ACA packages and their applications to advanced electronic packaging

Paik, Kyung-Wookresearcher; Son, HY; Kim, I; Chung, CK, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456, 2008-12-09

Wafer Level Fabrication of Plasmonic Nanopores using Solid-state Diffusion

Hwang, Charles Soon Hong; Lee, Young Seop; Jeong, Ki Hunresearcher, 한국광학회 2016년도 하계학술대회, (사)한국광학회, 2016-07-11

Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Son, HY; Chung, CK; Yim, MJ; Paik, Kyung-Wookresearcher, IEEE 56th Electronic Components and Technology Conference, pp.565 - 569, IEEE, 2006-05-30

Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wookresearcher, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Kim, I; Jang, KW; Son, HY; Kim, JH; Paik, Kyung-Wookresearcher, 2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224, 2008-05-27

Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection

Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wookresearcher, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27

Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

Paik, Kyung-Wookresearcher; Son, HY; Chung, CK, Polytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.153 - 158, 2007-01-15

Wafer polishing performance of silica slurries with silica particles grown by sol-gel method

Bae, SH; So, JH; Yang, Seung-Manresearcher; Kim, DH, Material Research Society 2000 Spring Meeting, 2000



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