Browse "College of Engineering(공과대학)" by Author Kwon, Yong-Min
Showing results 1 to 6 of 6
| Bildsensormodul und Verfahren zu seiner Herstellung Paik, Kyung-Wook; Yim, Myung-Jin; Son, Ho-Young; Kwon, Yong-Min |
| Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 mu m technology Lee, Min-Hyung; Kwon, Yong-Min; Pyo, Sung-Gyu; Lee, Han-Choon; Han, Jae-Won; Paik, Kyung-Wook, THIN SOLID FILMS, v.519, no.11, pp.3906 - 3913, 2011-03 |
| Studies on the effects of material design parameters on the board level reliabilities of wafer level chip size package (WLCSP) = 웨이퍼레벨 패키지(WLCSP)의 접합 후 신뢰성에 미치는 재료 설계 인자의 영향에 관한 연구link Kwon, Yong-Min; 권용민; et al, 한국과학기술원, 2011 |
| Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) with an Embedded Die Yu, Seon-Young; Kwon, Yong-Min; Kim, Jin-Su; Jeong, Tae-Sung; Choi, Seog-Moon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.4, pp.625 - 633, 2012-04 |
| Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability Kim, Hyoung-Joon; Chung, Chang-Kyu; Kwon, Yong-Min; Yim, Myung-Jin; Hong, Soon-Min; Jang, Se-Young; Moon, Young-Joon; et al, JOURNAL OF ELECTRONIC MATERIALS, v.36, pp.56 - 64, 2007-01 |
| Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10 |
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