Showing results 1 to 3 of 3
Experimental evaluation of anodic bonding process based on the Taguchi analysis of interfacial fracture toughness Go, JS; Cho, Young-Ho, SENSORS AND ACTUATORS A-PHYSICAL, v.73, no.1-2, pp.52 - 57, 1999-03 |
Heat transfer enhancement using flow-induced vibration of a microfin array Go, JS; Kim, SungJin; Lim, G; Yun, H; Lee, J; Song, I; Pak, YE, SENSORS AND ACTUATORS A-PHYSICAL, v.90, no.3, pp.232 - 239, 2001-05 |
Snapping microswitches with adjustable acceleration threshold Go, JS; Cho, Young-Ho; Kwak, Byung Man; Park, K, SENSORS AND ACTUATORS A-PHYSICAL, v.54, no.1-3, pp.579 - 583, 1996-06 |
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