Browse "College of Engineering(공과대학)" by Type Article
Showing results 51841 to 51860 of 63244
| Three-dimensional finite element simulation of connecting rod forging using a new remeshing scheme Cho, JR; Yang, Dong-Yol, ENGINEERING COMPUTATIONS, v.15, no.6-7, pp.777 - 804, 1998 |
| Three-Dimensional Finite Element Simulation of Shape Rolling of Bars Kim, SY; Im, Yong-Taek, INTERNATIONAL JOURNAL OF FORMING PROCESS, v.3, no.3-4, pp.253 - 278, 2000-01 |
| Three-dimensional finite-element analysis of the compression molding of sheet molding compound Kim, SY; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.67, no.1, pp.207 - 213, 1997-05 |
| Three-dimensional finite-element analysis of the compression molding of sheet molding compound Kim, Soo-Young; Im, Yong-Taek, Journal of Materials Processing Technology, Vol.67, No.1-3, pp.207-213, 1997-05 |
| Three-dimensional finite-element analysis of the compression molding of sheet molding compound Kim, Soo-Young; Im, Yong-Taek, Journal of Materials Processing Technology, Vol.67, No.1, pp.207-213, 1997-05 |
| Three-dimensional finite-element analysis of the quenching process of plain-carbon steel with phase transformation Kang, SH; Im, Yong-Taek, METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.36A, no.9, pp.2315 - 2325, 2005-09 |
| Three-dimensional flow characteristics of aluminum alloy in multi-pass equal channel angular pressing Jin, Young-Gwan; Son, Il-Heon; Im, Yong-Taek, METALS AND MATERIALS INTERNATIONAL, v.16, no.3, pp.413 - 420, 2010-06 |
| Three-dimensional fluorescence microscopy through virtual refocusing using a recursive light propagation network Shin, Changyeop; Ryu, Hyun; Cho, Eun-Seo; Han, Seungjae; Lee, Kang-Han; Kim, Cheol-Hee; Yoon, Young-Gyu, MEDICAL IMAGE ANALYSIS, v.82, 2022-11 |
| Three-dimensional frequency-dependent infinite elements for soil-structure interaction Seo, CG; Yun, Chung Bang; Kim, JM, ENGINEERING STRUCTURES, v.29, no.11, pp.3106 - 3120, 2007-11 |
| Three-dimensional Gd-doped TiO2 fibrous photoelectrodes for efficient visible light-driven photocatalytic performance Choi, Junghyun; Sudhagar, P.; Lakshmipathiraj, P.; Lee, Jung Woo; Devadoss, Anitha; Lee, Sangkyu; Song, Taeseup; et al, RSC ADVANCES, v.4, no.23, pp.11750 - 11757, 2014 |
| Three-dimensional graphene micropillar based electrochemical sensor for phenol detection Liu, Fei; Piao, Yunxian; Choi, Jong Seob; SEO, TAE SEOK, BIOSENSORS & BIOELECTRONICS, v.50, pp.387 - 392, 2013-12 |
| Three-Dimensional Graphene Oxide Nanostructure for Fast and Efficient Water-Soluble Dye Removal Liu, Fei; Chung, So-Yi; Oh, Ga-Hee; Seo, Tae-Seok, ACS APPLIED MATERIALS & INTERFACES, v.4, no.2, pp.922 - 927, 2012-02 |
| Three-dimensional hollow fiber type of carbon nanotube electrode for enhanced ion adsorption capacity Lee, Mi-Young; Kim, Heeyoung; Kim, Jong-Oh; Kang, Seoktae, DESALINATION AND WATER TREATMENT, v.90, pp.46 - 53, 2017-09 |
Three-dimensional hot electron photovoltaic device with vertically aligned TiO2 nanotubes Goddeti, Kalyan Chakravarthy; Lee, Changhwan; Lee, Young Keun; Park, Jeong Young, SCIENTIFIC REPORTS, v.8, 2018-05 |
| Three-dimensional hydrodynamic flow and particle focusing using four vortices Dean flow Ha, Byunghang; Lee, Kang Soo; Jung, Jinho; Sung, Hyung-Jin, MICROFLUIDICS AND NANOFLUIDICS, v.17, no.4, pp.647 - 655, 2014-10 |
| Three-dimensional hydrodynamic focusing with a single sheath flow in a single-layer microfluidic device Lee, Myung-Gwon; Choi, Sung-Young; Park, Je-Kyun, LAB ON A CHIP, v.9, no.21, pp.3155 - 3160, 2009-11 |
| Three-dimensional imaging using fast micromachined electro-absorptive shutter Park, Yong-Hwa; Cho, Yong-Chul; You, Jang-Woo; Park, Chang-Young; Yoon, Hee-Sun; Lee, Sang-Hun; Kwon, Jong-Oh; et al, JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, v.12, no.2, 2013-04 |
| Three-Dimensional Infinite Elements for Wave Force Evaluation on Offshore Structures Park, Woo Sun; Yun, Chung Bang; Pyun, Chong Kun; 박, 우선; 윤, 정방; 편, 종근, 전산구조공학, Vol.4, No.4, pp.135-144, 1991-12 |
| Three-Dimensional Integration Approach to High-Density Memory Devices Kim, Hojung; Jeon, Sanghun; Lee, Myoung-Jae; Park, Jaechul; Kang, Sangbeom; Choi, Hyun-Sik; Park, Churoo; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.58, no.11, pp.3820 - 3828, 2011-11 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
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